国家/地区 中国（13）
IPC部 C（14） B（5） H（2）
IPC大类 C08（14）
IPC小类 C08L（14）
IPC C08L063/00（14）
发明人 LIU H（2） WANG N（2）
公开年 2021（9） 2020（3） 2022（2）
申请年 2020（14）
专利权人

Preparing graphene-based wave absorbing honeycomb useful is in radar stealth material comprises mixing tubular graphene, alicyclic epoxy resin and organic solvent, grinding, coating obtained tubular graphene/alicyclic epoxy resin to honeycomb core hole wall and drying.

YANG R, ZHAO Z, LIU R

Graphene film, which is not calendered, and graphene film has airtight bubble structure.

WANG N

Manufacture of fluorescent epoxy transparent wood involves treating wood with treatment solution containing sulfite and treatment solution comprising hydrogen peroxide, impregnating with epoxy resin composition comprising quantum dots, and curing composition.

SONG S, LEE C K

High thermal conductivity carbon fiber composite material with laminated hybrid structure comprises combination of carbon fiber cloth layer, sheet filler thermal conductivity network, and sheet sandwich ball laminated structure.

WANG H, SUN X, ZHANG J, MA C, LU N, ZENG Y, REN W, LIU C, CHENG H

Composition useful for Fifth Generation mobile phone middle frame, comprises polyamide, thermosetting resin, thermally conductive filler, glass fiber, toughening agent, antioxidant and lubricant.

SU X, ZHANG D, QU X, ZHENG Y, LI W

High-efficiency antibacterial heat-conducting wear-resistant layer used for floor, is prepared by blending e.g. resin substrate, graphene filler, ceramic filler, curing agent, solvent, antioxidant and additive, hot pressing, and molding.

XIAO P, WANG Q, LIU H

High thermal conductivity epoxy resin composite material comprises epoxy resin, mixed thermally conductive filler, triethylenetetramine curing agent, acetone and magnesium hydroxide powder.

YUE G

Preparing a complex thermal interface material based on three-dimensional graphene comprises e.g. preparing oxide-modified graphene complex hydrogel by self-assembly method, and preparing three-dimensional graphene complex aerogel.

TAN H, PAN Z

Heat-resistant composite dielectric material comprises epoxy resin as substrate, and benzoxazine additive curing, and boron nitride nano sheet and fluorinated graphene as filler, by stripping hexagonal boron nitride into nano-sheet.

REN J, QIU Y, QING Q, BAO P, XU G

Low-temperature resistant polymer insulating and thermally conductive composite material comprises e.g. high-density polyethylene, micron silicone oil lubricant epoxy resin matrix, curing agent, polypropylene resin and polyimide.

DU C, JIA X, WANG W, YU H, YAN Y