国家/地区 美国（4）
IPC部 C（4） B（3） H（3）
IPC大类 C08（4）
IPC小类 C08K（4） C08L（4） B82Y（2）
C08G（2） H01B（2） H01L（2）
H05K（2）
IPC C08K003/04（4）
发明人
公开年 2012（4）
申请年 2011（2）  2012（2） 
专利权人

Semiconductor sealing material composition used as packaging material to protect electronic part e.g. diode comprises epoxy resin; hardener; curing catalyst; additive such as coupling agent; and nano-graphene plate powder as filler.

CHOI S, PARK S, CHOI S H, PARK S H, HONG C S, HUI P S

Product, useful as a polymer system, comprises a shape memory polymer material, and a graphene material incorporated into the shape memory polymer material to form the polymer system.

XIAO X, XIE T, CHENG Y T

Electrically insulating and thermally conductive composition useful in electronic device e.g. computer, comprises resin, electrically insulating and thermally conductive powder, and graphene in specific amounts.

LIN C, WU M, CHIOU K, LIN C L, WU M J, CHIOU K C, LIN Z, QIU G

Polymer resin composition useful for manufacturing an insulating film for manufacture of a build-up multi-layered printed circuit board, comprises polymer resins, and graphene for linking the polymer resins with larger attraction.

LEE K S, HONG S S, LIM H H, LEE H Y, CHO J C, KYU S L, SANG S H, HYUN H L, HWA Y L, JAE C C, HONG S, LEE H, LEE K, LIN H, JO J, LIM H, CHO J