国家/地区 韩国（4）
IPC部 C（4）
IPC大类 C08（4）
IPC小类 C08K（4） C08L（4） C08J（2）
C09K（2）
IPC C08K003/04（4）
发明人 SONG J（3） LEE E J（2） LEE K（2）
LEE K D（2） NAM C R（2） SEO M K（2）
SONG J H（2）
公开年 2023（4）
申请年 2021（2）  2022（2） 
专利权人 HANSOL CHEM .（2）

Flexible polymer heat dissipation sheet comprises matrix resin containing nitrile-butadiene rubber, acrylic resin, epoxy resin, phenoxy resin, urethane resin, and/or silicone resin, graphene particles and dispersing agent.

YOO T H, PARK M W, WOO Y H, HWANG S H, HUANG S, YUN H, PARK M, LIU T

Heat dissipation adhesive sheet useful in electronic components e.g. semiconductors, or PC boards comprise metal thin film layer formed on lower surface of heat dissipation layer, and adhesive layer on metal thin film layer.

HUN L S, SONG J, KWON H J, CHOI S, YUMINSOOK, YOUK S K

Heat dissipation composite composition used for forming heat dissipation composite, comprises epoxy resin, and phase change material, and includes polymer matrix formed by chemical bonding of epoxy resin and phase change material.

SEO M K, LEE E J, SONG J H, LEE K D, NAM C R, SONG J, LEE K

Manufacturing heat dissipation composite by melting and stirring epoxy resin, phase change material, and curing agent, curing at temperature higher than curing temperature of epoxy resin to form matrix, and simultaneously performing secondary main curing and high-density compression processing.

SEO M K, LEE E J, SONG J H, LEE K D, NAM C R, SONG J, LEE K