国家/地区 台湾（4）
IPC部 C（4）
IPC大类 C08（4）
IPC小类 C08K（4） C08L（4） C08J（3）
C08G（2） H01L（2）
IPC C08L079/08（4）
发明人
公开年 2021（2）
申请年 2020（2） 
专利权人

Condensation curable composition for use in cured silicone-imide material for article in aerospace device, electronic device, electronic component, automobile, insulation, coating, or solvent resistant membrane, comprises silicone-imide base polymer, crosslinker, and condensation cure catalyst.

KONWAR D B, FUJIMOTO T, MANDAL S

Maleimide resin film used in maleimide resin composition and as adhesive resin film having low dielectric property, comprises maleimide, (meth)acrylate, inorganic particles with respect to whole resin film and curing catalyst.

IGUCHI H, TSUTSUMI Y, KASHIWAGI T, DI J

Graphite sheet useful for electronic device, has thermal conductivity in plane direction, and thermal conductivity in thickness direction.

KIM K S, WON D Y, CHOI J Y, CUI Z, YUAN D, JIN J

Electrically insulating and thermally conductive composition useful in electronic device e.g. computer, comprises resin, electrically insulating and thermally conductive powder, and graphene in specific amounts.

LIN C, WU M, CHIOU K, LIN C L, WU M J, CHIOU K C, LIN Z, QIU G