国家/地区 美国（6）
IPC部 C（6） B（2）
IPC大类 C08（6）
IPC小类 C08K（6） C08L（6） C01B（3）
C08J（3） B29C（2） C04B（2）
C09K（2）
IPC C08L079/08（6）
发明人 DE LUNA R M（2） MAPKAR J A（2）
公开年 2021（6）
申请年 2019（2）  2021（2） 
专利权人 EATON INTELL.（2）

Phthalonitrile composite material for heat conduction and insulation fields, involves heat conducting filler distributed in phthalonitrile matrix resin or heat conducting filler layer partially covered on phthalonitrile micro-sphere surface.

ZHOU H, GUO Y, ZHAO T, LIU X, DING J, ZHAO Z

Forming electrically conductive deposition material extrudable in fluid state for deposition via additive manufacturing system and forming three-dimensional object, involves pre-mixing polymer component and extrudability component.

DE LUNA R M, MAPKAR J A

Electrically conductive deposition material extrudable in fluid state for deposition via additive manufacturing system, comprises polymer component, filler component comprising strengthening component and extrudability component.

MAPKAR J A, DE LUNA R M

Elastic heat spreader film used for forming structural component, comprises graphitic film comprising graphitic crystals, and having preset thermal conductivity, electroconductivity and physical density, and elastomer or rubber.

LIN Y, JANG B Z, ZHANG B, JEAN B

Maleimide resin film used in maleimide resin composition and as adhesive resin film having low dielectric property, comprises maleimide, (meth)acrylate, inorganic particles with respect to whole resin film and curing catalyst.

IGUCHI H, TSUTSUMI Y, KASHIWAGI T, DI J

Graphite sheet useful for electronic device, has thermal conductivity in plane direction, and thermal conductivity in thickness direction.

KIM K S, WON D Y, CHOI J Y, CUI Z, YUAN D, JIN J