国家/地区 中国（4）
IPC部 C（4）
IPC大类 C08（4）
IPC小类 C08K（4）
IPC C08K003/04（4）
发明人 CHEN C（2） WANG D（2） YANG L（2）
ZHAO J（2） ZHAO X（2） ZHOU H（2）
公开年 2023（4）
申请年 2023（2） 
专利权人 UNIV JILIN（2）

Preparing high thermal conductivity and low dielectric epoxy composite material used in electronic packaging field, involves preparing polyimide, dispersing polyimide microspheres and low-dimensional thermally conductive insulating fillers in solvent, mixing polyimide microsphere with epoxy resin.

ZHONG R, LIANG J, CAI H, TU S, HU D

Preparing three dimensional thermally conductive skeleton/polyimide thermally conductive composite material comprises subjecting thermally-conducting porous material soaked by polyamic acid solution, performing freeze drying and phase conversion treatment to thermally-conducting porous material.

CHEN C, ZHAO X, ZHOU H, ZHAO J, YANG L, WANG D

Preparing thermally conductive filler/polyimide aerogel metallized high thermally conductive composite material, involves preparing thermally conductive filler/polyimide aerogel, electroplating aerogel material, and vacuum hot pressing.

CHEN C, ZHAO X, ZHOU H, ZHAO J, YANG L, WANG D

Preparing ultra-high elastic polyimide fiber/graphene composite gas gel comprises e.g. dispersing polyimide chopped fiber in alkali solution, performing surface modification, mixing graphene solution dispersion liquid with polyimide chopped fiber, dialyzing, freezing and drying.

FENG Y, YIN W, FENG W