国家/地区 台湾（6）
IPC部 C（6） A（3） H（3）
IPC大类 C08（6）
IPC小类 C08K（6） C08L（6） C08G（3）
C09D（3） A61B（2） C08F（2）
H01B（2）
IPC C08L083/04（6）
发明人 FUJIMOTO T（2） HATAKEYAMA J（2）
公开年 2022（6）
申请年 2021（4） 
专利权人 MOMENTIVE PE.（2） SHINETSU CHE.（2）

One-component thermal-gel composition used for heat dissipating material for dissipating heat from substrate, comprises crosslinkable organopolysiloxane, hydrolyzable organopolysiloxane, thermal conductivity enhancing agent, organopolysiloxane, adhesion promoter, antioxidant, and pigment.

DUTTA P, DASGUPTA D, MS A, FUJIMOTO T, CHISATO H, ANJITHA M, HOSHINO C

Condensation curable composition used as article in aerospace device, electronic device, electronic component, automobile, insulation, coating, or solvent resistant membrane, comprises condensation curable organopolysiloxane, silicone-imide crosslinker, condensation cure catalyst and additive.

DEY K, MILLER C, KONWAR D B, RAJENDRA V, FUJIMOTO T, MANDAL S

Bio-electrode composition used for detecting heart rate by electric signal transmitted from skin, comprises reaction composite, monomer with ionic functional group, salts of ammonium, lithium, sodium, potassium, and silver.

HATAKEYAMA J

Bio-electrode composition used in contact with skin of living body for detecting physical conditions such as heart rate, comprises (A) reaction composite comprising ionic polymer material and carbon particle.

HATAKEYAMA J, SHANRUN

Composite material for electromagnetic wave shielding or electromagnetic wave absorption, comprises electromagnetic wave absorbing materials containing two-dimensional graphene sheets, which is obtained by crushing carbon raw material through cavitation principle in liquid phase exfoliation method.

XIE Y, HE X, LIU W, HO H, HSIEH I

Heat-conductive silicone heat radiation material used as thermal interface material between heating portion of electronic component and heat sink comprises silicone polymer, heat-conductive inorganic filler, and heat-resistance improver.

KOBAYASHI S, KIMURA Y, SHINGO K, YUKO K