国家/地区 韩国（8）
IPC部 C（8）
IPC大类 C08（8）
IPC小类 C08K（8）
IPC C08K003/04（8）
发明人
公开年 2022（4） 2021（2） 2023（2）
申请年 2022（3）  2020（2）  2021（2） 
专利权人

Composition useful for preparing light-shielding film of smartphone camera module as spacer, washer and coating solution comprises carbon-based particles, thermosetting binder resins, dispersants, polymer beads and solvents.

PARK S C, YUN J H, KIM Y S, KIM Y, PIAO S

Composition for manufacturing chemical detection sensor for detecting chemical substances comprises graphene nanoplatelets, polyaniline, alkyl cellulose, 2-ethoxyethanol, ester-based resin, curing agent, ammonium hydroxide and carbon black.

SHIM C, KU H

Paste for reference electrode used in biosensor, comprises mixture of silver chloride powder and carbon-based conductive material.

KANG Y J, JEONG I S, PARK C H, KIM S J, PARK Y B, PARK Y, KIM S, PARK C, JEONG I, KANG Y, CHONG I, JUN K S, CHEON I S

Manufacture of antistatic sheet used for manufacturing e.g. photomask storage case, involves forming antistatic layer using antistatic composition containing polymer resin and conductive polymer, on polymer substrate, forming adhesive layer, and forming another antistatic layer on adhesive layer.

HAM S, PARK J H

Functional mask used for checking fever, comprises earring straps on mask material comprising body temperature checking unit provided with Zion pigment layer and metal heat transfer layer formed by coating composition containing graphene.

HUN L S

Composition useful in damping material for ship sonar dome, comprises polyol, isocyanate-based curing agent, reduced graphene oxide and pigment.

KIM W H, KIM H M, SEOK S M

Foldable display device e.g. in TV comprises e.g. heat dissipation substrate disposed on support substrate, including copper and their alloy and heat dissipation coating layer on surface of heat dissipation substrate, includes base resin.

LEE K H, CHOI S, LEE M

Manufacture of substrate for device for shielding electromagnetic radiation, involves providing polymer material and/or precursor comprising conductive filler, and subjecting polymer material and/or precursor to shaping with material bond.

SCHROIFF V, SUTTER M, HAUER M, GRUNE E