国家/地区 中国（40） 世界知识产权组织（8） 美国（7） 欧洲专利局（EPO）（4） 日本（4） 韩国（3） 加拿大（2）
IPC部 C（44）
IPC大类 C08（44）
IPC小类 C08K（44）
IPC C08K003/22（44）
发明人 ZHANG C（4） ZHANG L（4） ZHANG Y（4）
ALSHARAEH E（3） LI M（3） LIN Y（3）
ALMOHSIN A（2） CHEN Y（2） DING P（2）
LI J（2） LI W（2） LI Z（2）
LIU M（2） LIU Y（2） LU Y（2）
公开年 2021（44）
申请年 2020（25）  2021（11）  2019（8） 
专利权人 SAUDI ARABIA.（3） ARAMCO SERVI.（2） DEYANG ZHONG.（2） UNIV ALFAISA.（2）
UNIV BEIJING.（2） UNIV SHANGHA.（2）

Flowable hardenable composition used in electronic heat sink assembly, comprises shaped composite particles, having thermal filler particles having specific aspect ratio retained in binder matrix, dispersed in hardenable binder precursor.

PEREZ M A, MARTINEZ J A

Preparing heat-conducting engineering plastic involves carboxylation treatment, pretreatment, sintering, ionization, drying, ball milling, hydrogel preparation, aerogel preparation and finished products.

GAO X

Light-responsive liquid-gas phase change composite material useful for preparing light-responsive device, comprises dispersion medium and dispersed phase including low-boiling point liquid and multifunctional filler.

XU G, GAO Q, SUN A, GUO J, LONG F, ZHAO Z, FANG M, SHAO Y, CHENG Y

Thermal conductive materials comprises methyl vinyl silicone oil, hydrogen silicone oil, modified alumina particles, graphene fiber powder, propanol solution, coupling agent, catalyst, inhibitors, cross-linking agent, antioxidants and flame retardant.

PU S

Phthalonitrile composite material for heat conduction and insulation fields, involves heat conducting filler distributed in phthalonitrile matrix resin or heat conducting filler layer partially covered on phthalonitrile micro-sphere surface.

ZHOU H, GUO Y, ZHAO T, LIU X, DING J, ZHAO Z

Composition for coating and for forming a coating on substrate e.g., surface of boat or ship comprises epoxy-functional monomers, diluent, and sufficient amount of hydrophobicity-modifying additive that is reactive in epoxide polymerization.

GAIER M, ALGERMOZI M, RODIONOV I

Preparing polymer composite involves dispersing nanosheet filler within polymer matrix by dissolving monomer in water to form first solution, dispersing nanosheet filler in organic solvent in the presence of emulsifying agent.

MICHAEL F M, ALSHARAEH E, ALMOHSIN A

Cooling structure used for cooling article, comprises infrared ray and UV ray absorption and emission layer comprising polymer matrix and conversion material comprising nanoparticles of core-shell structure including core formed of semiconductor material and shell, and visible light reflective layer.

OH S J, LEEHEON, JEON S, SONSUMIN

Preparation of polyimide composite molded plastic used for e.g. electronic appliances, involves hot-molding thermally conductive polyimide composite powder material, mixing with solvent, aromatic diamine and aromatic dibasic acid anhydride, and heat-molding powdery polyimide composite molding powder.

XU G, XUE F, ZHOU J

Silicone resin composition used for composite material for heat conductive silicone sheet for electronic component, comprises silicone resin and heat resistance improving agent comprising organic polycyclic aromatic compound containing secondary amino groups and ketone groups in cyclic structure.

MAKOTO I, KATSUYUKI S, YUJI N, IWAI M, SUZUMURA K, NAKAJIMA Y, NAKASHIMA Y