国家/地区 台湾（6）
IPC部 C（6）
IPC大类 C08（6）
IPC小类 C08K（6） C08G（5） C08L（5）
C08J（4） C09D（3） H01L（3）
IPC C08K003/22（6）
发明人 FUJIMOTO T（3） MANDAL S（3） KONWAR D B（2）
MILLER C（2） RAJENDRA V（2）
公开年 2022（4） 2021（2）
申请年 2020（6）
专利权人 MOMENTIVE PE.（3）

Condensation curable composition used as article in aerospace device, electronic device, electronic component, automobile, insulation, coating, or solvent resistant membrane, comprises condensation curable organopolysiloxane, silicone-imide crosslinker, condensation cure catalyst and additive.

DEY K, MILLER C, KONWAR D B, RAJENDRA V, FUJIMOTO T, MANDAL S

Addition curable silicone-imide composition for cured silicone-imide material for e.g., aerospace device, comprises alkenyl functional siloxane-imide copolymer, alkenyl functional organosiloxane, polyorganohydrogensiloxane and catalyst.

MILLER C, NARAYANAN R, ZAMPELLA J, RAJENDRA V, FUJIMOTO T, MANDAL S

Condensation curable composition for use in cured silicone-imide material for article in aerospace device, electronic device, electronic component, automobile, insulation, coating, or solvent resistant membrane, comprises silicone-imide base polymer, crosslinker, and condensation cure catalyst.

KONWAR D B, FUJIMOTO T, MANDAL S

Electrically conductive one-component epoxy adhesive composition for e.g. solar cell comprises epoxy resin, at least one ionic constituent as catalyst for epoxy homo-polymerization, electrically conductive particles, and inorganic particles.

POELLER S, WUCHERPFENNIG S, ESTRUGA ORTIGA M, HENCKENS A, ESTRUGA O M, STEINKOGLER S, ESTRUGAORTIGAMARQUE, POHL S

Silicone resin composition used for composite material for heat conductive silicone sheet for electronic component, comprises silicone resin and heat resistance improving agent comprising organic polycyclic aromatic compound containing secondary amino groups and ketone groups in cyclic structure.

MAKOTO I, KATSUYUKI S, YUJI N, IWAI M, SUZUMURA K, NAKAJIMA Y, NAKASHIMA Y

Maleimide resin film used in maleimide resin composition and as adhesive resin film having low dielectric property, comprises maleimide, (meth)acrylate, inorganic particles with respect to whole resin film and curing catalyst.

IGUCHI H, TSUTSUMI Y, KASHIWAGI T, DI J