国家/地区 日本（6）
IPC部 C（6） H（3）
IPC大类 C01（6）
IPC小类 C01B（6）
IPC C08K003/04（3） C01B032/174（2） C01B032/194（2）
C08K003/38（2） C09C001/44（2） C09C003/10（2）
C09D017/00（2） H01B001/24（2）
发明人 DOI S（2） KAMABAYASHI J（2） SHIMANAKA H（2）
公开年 2022（6）
申请年 2021（3）  2020（2） 
专利权人 DAINICHISEIK.（2）

Composition used for three-dimensional printing e.g. additive manufacturing, comprises particles comprising thermoplastic polymer grafted to carbon nanomaterial, and particles have preset aerated density.

FARRUGIA V M, SRISKANDHA S E, CLARIDGE R, SRISKANDAR S E, EMPARUZIA V, SIBANTIISWARISLISKANDA

Surface modified hexagonal boron nitride particles used for thermally conductive resin composition, have partially reduced graphene oxide adsorption layer on surface of untreated hexagonal boron nitride particle.

ZAIMA H, SUGIMORI S, ONAKA J, ITO G

Conductive composition used for forming conductive film used for applications such as conductive wiring, antenna materials for radio frequency identification, electromagnetic wave shielding materials, and materials for sensors, comprises binder resin and boron-containing carbon material.

NAKASONE D, KAWAHARA J, ANDO A

Graphene nanoribbon used as channel for e.g. semiconductor device, is 2,12-bis(anthracen-9-yl)-6,16-dithiapentacycloicosa-1,3,5(9),7,10,12,14,17,19-nonaene-based compound or 2,12-bis(anthracen-9-yl)-6,18-dithiapentacycloicosa-1,3,5(9),7,10,12,14,16,19-nonaene-based compound.

OTOMO M, SATO S, HAYASHI H, YAMADA Y

Resin process carbon material used for e.g., carbon material composite composition, comprises carbon material selected from carbon fibers, carbon nanotubes, graphite and graphene, and a resin having block copolymer.

SHIMANAKA H, KAMABAYASHI J, MURAKAMI K, DOI S, HASHIMOTO R

Carbon material dispersion liquid used for manufacturing e.g. paints, comprises carbon material containing carbon black, organic solvent, and polymer dispersant comprising amine-containing structural unit, propanone-containing structural unit, and other structural units connected to these units.

HIROYUKI S, YOSHIKAZU M, JUN K, SEIJI D, SHIMANAKA H, MURAKAMI Y, KAMABAYASHI J, DOI S