国家/地区 中国（80） 韩国（7） 世界知识产权组织（5） 美国（4） 印度（2）
IPC部 C（93） B（9） H（5）
F（2） G（2）
IPC大类 C08（93）
IPC小类 C08G（93）
IPC C08G059/50（93）
发明人 WANG Y（7） XU X（5） LI W（4）
LIU J（4） LIU S（4） MIAO J（4）
ZHANG Y（4） CHEN L（3） GUO Q（3）
LI G（3） LI H（3） LI J（3）
LI X（3） WANG X（3） WANG Z（3）
公开年 2022（24） 2017（15） 2021（12） 2018（10） 2023（9） 2019（7） 2016（5） 2015（4） 2020（4）
申请年 2021（24）  2016（16）  2022（13）  2020（10）  2018（8）  2017（7）  2019（7）  2015（3）  2013（2）  2014（2） 
专利权人 WUXI CHANGAN.（4） EVONIK OPERA.（3） ANHUI KAILIN.（2） ARAMCO SERVI.（2）
CHANGZHOU SH.（2） GUANGDONG JO.（2） SAUDI ARABIA.（2） UNIV ALFAISA.（2）
UNIV BEIJING.（2） UNIV INHA RE.（2） UNIV SHANGHA.（2） UNIV SOUTH C.（2）

Manufacturing composite material comprises e.g. preparing foam structure using composite resin containing hexanediol diacrylate and graphene, preparing composite by filling structure with mixture and curing composite.

HOUN K J, CHOI H J

Processing cold-rolled steel strip with radiating function comprises e.g. ultrasonically dispersing diethylenetriamine, sodium ethylate and absolute ethanol, adding 1H,1H,2H,2H-perfluorooctyl methacrylate, dispersing heat conducting filler and absolute ethanol, and adding modified curing agent.

LI J, ZHU X, ZHOU H

Preparing high-reliability epoxy resin absorbing adhesive film with controllable fluidity by mixing epoxy resin matrix and toughener to compound epoxy resin system, placing epoxy resin system, absorbent, and inorganic filler into resin internal mixer for banbury rough mixing and fine mixing.

GONG Y, LIU J, LI M, LI Y, LV T

Graphene magnetic ring powder coating comprises tris(hydroxyphenyl)methane type epoxy resin, novolak epoxy resin, graphene, composite curing agent, glass fiber, composite coupling agent, pigments and fillers, titanium dioxide, and barium sulfate.

ZHOU C, LI D, YIN Y

Epoxy resin composite material with low viscosity and high mechanical strength for preparing high performance epoxy system with low viscosity and high mechanical strength comprises epoxy resin, curing agent, multidimensional composite dispersion liquid and reinforcing agent.

CHENG J, CHEN Y, ZHANG J

Amine composition used in epoxy system for producing structural or electrical laminates, coatings, castings, structural components, circuit boards, electrical varnishes, encapsulants, and semiconductors, comprises alkylated diamine, tertiary amine and polyoxyalkyleneamine.

PENG Q, LI S

Heat dissipation adhesive sheet useful in electronic components e.g. semiconductors, or PC boards comprise metal thin film layer formed on lower surface of heat dissipation layer, and adhesive layer on metal thin film layer.

HUN L S, SONG J, KWON H J, CHOI S, YUMINSOOK, YOUK S K

High-performance aqueous-based industrial anticorrosion coating useful for preventing corrosion of metal comprises graphene, aluminum tripolyphosphate, zinc phosphate, aqueous-based epoxy resin, aqueous-based epoxy curing agent, deionized water, hollow glass microspheres, and antifoaming agent.

ZHU W, MA B, MIAO S, WANG Z, WANG Y

Manufacturing carbon fiber reinforced epoxy composites reinforced with graphene oxide/graphite nanofiber composite comprises impregnating graphene oxide/graphite nanofiber composite, epoxy resin and curing agent into carbon fibers.

PARK S, HWANG K S, KIM Y

Anticorrosive coating for corrosion prevention application, comprises phenolic aldehyde modified epoxy resin and 2-methylimidazolium titanium complex modified curing agent.

WANG Z, HAN W, SU B, LI L, ZHANG Y, YANG Y