国家/地区 中国（7）
IPC部 C（7） H（2）
IPC大类 C08（7）
IPC小类 C08G（7）
IPC C08G073/10（7）
发明人 XU Z（7）
公开年 2021（4）
申请年 2021（4）  2022（2） 
专利权人 ZHEJIANG ZHO.（5）

Polyimide paint useful for high heat-resistant enameled wire for electronic appliances, household appliances and instrument equipment, comprises polyamic acid solution obtained by polycondensation of aromatic dianhydride, aromatic diamine and fluorinated amino graphene.

XU Z, LIU G, ZHU C, CAO H, ZHANG Q

Preparing high thermal conductivity polyimide film by mixing alkynylated graphene and N,N-dimethylformamide, ultrasonically dispersing, ultrasonically dispersing magnetic boron azide and N,N-dimethylformamide, adding sodium ascorbate and triethylamine, and adding copper sulfate pentahydrate.

XU Z, XU J

Polyimide binder for silicon-based negative electrode sheet of a lithium battery, is prepared from imidazole group-containing diamine, sulfonated diamine, and ketone group-containing dianhydride through copolymerization and imidization.

XU Z, LIU G, ZHANG Q

Transparent polyimide composite conductive film comprises silver nanowire layer and graphene oxide layer attached to transparent polyimide base film surface.

JIN W, XU Z, QUE X

Graphene in-situ modified polyimide film is prepared by polycondensation of graphene grafted with aminosiloxane on the surface, diamine and dianhydride and forming into film.

XU Z, LIU G, ZHANG Q

Preparing polyimide/graphene composite thermally conductive film, involves performing polycondensation of dianhydride, crosslinking polyamic acid and polyvinyl alcohol followed by subjecting film-forming mixture to thermal imidization.

XU Z, LIU G, ZHANG Q

Preparation of low dielectric constant polyimide/multi-graphene oxide composite film involves adding modified graphene oxide to diamine/dianhydride solution, dispersing, molding polyamic acid solution, heating gel film and drying.

XU Z, YUAN Y, ZHANG C, WU L