国家/地区 中国（4） 世界知识产权组织（2）
IPC部 C（4）
IPC大类 C08（4）
IPC小类 C08G（4）
IPC C08K003/36（4）
发明人
公开年
申请年
专利权人

Plug hole resin with low temperature resistance and high thermal conductivity used in circuit board production technology, e.g. deep sea, deep space and polar detection field comprises epoxy resin, reactive diluent, latent curing agent, imidazole curing accelerator, antifoaming agent, and filler.

LI Q, YANG X, JIANG M, ZHANG Z, HE Z, HU B, DENG W, CHEN L

Ionic polymer used in polymer composition for forming electrolyte for electrode of electrochemical cell, comprises repeating unit which is obtained by reacting functional groups-containing compound and metal bis(halosulfonyl)imide compound.

DAIGLE J, LAROUCHE A, CHAREST P, GUERFI A, DONTIGNY M, ARMAND M, HINTENNACH A, ZAGHIB K, CHARREST P, DONITY M

Photosensitive polyimide resin composition comprises photosensitive polyimide derivative, photoinitiator, free radical polymeric compound, solvent, alumina, graphene, inorganic clay, silicon oxide and zinc oxide.

HUANG T, ZHUANG C, SHI Y, XIE K, HUANG T C, CHUANG C C, SHIH Y C, HSIEH K H

Synthesis of ternary nano composite material used for super capacitor electrode material, comprises putting MCM-41 to hydrochloric acid, adding aniline monomer, adding oxidant ammonium persulfate, and adding oxidized graphene suspension.

WANG L, YAN Z, MA Y, FAN Q, FENG X, HUANG W