国家/地区 中国（4） 日本（4） 韩国（4） 美国（4） 欧洲专利局（EPO）（3） 台湾（3） 世界知识产权组织（3）
IPC部 C（5）
IPC大类 C08（5）
IPC小类 C08G（5）
IPC C08L067/04（5）
发明人 JIN R（2） KIM Y S（2）
公开年 2021（3）
申请年 2021（3） 
专利权人 TICONA LLC（2）

Bio-resin composite for bio-foam material comprises a polymer matrix, a toughener, dispersed in the polymer matrix, and an antistatic agent, present at an interface between the polymer matrix and the toughener and/or present in the toughener.

LIOU S, LIU Y, CHENG S, CHANG S, LIAO S

Electronic device e.g. printed circuit board, comprises singulated carrier portion, substrate molded onto singulated carrier portion, and conductive traces disposed on substrate, where substrate comprises polymer composition that includes aromatic polymer and electrically conductive filler.

KIM Y S, JIN R

Polymer composition used for forming substrate for electronic device, comprises liquid crystalline polymer, electroconductive filler, and mineral filler, and has preset surface resistivity.

KIM Y S, JIN R

Ionic polymer used in polymer composition for forming electrolyte for electrode of electrochemical cell, comprises repeating unit which is obtained by reacting functional groups-containing compound and metal bis(halosulfonyl)imide compound.

DAIGLE J, LAROUCHE A, CHAREST P, GUERFI A, DONTIGNY M, ARMAND M, HINTENNACH A, ZAGHIB K, CHARREST P, DONITY M

Insulating layer composition for use in substrate of insulating prepreg or insulating film and printed circuit board, comprises soluble type liquid crystal thermosetting oligomer, metal alkoxide compound, and graphene oxide.

JI S Y, HAM S J, KIM S H, KIM D Y, YEONG J S, JIN H S, HWAN K S, YEONG K D, CHI S, KIM S, KIM D, HAM S, CHI S Y, HAMSUKJIN