国家/地区 台湾（5）
IPC部 C（5）
IPC大类 C08（5）
IPC小类 C08G（5）
IPC C08G077/455（4） C08K003/22（4） C08L083/10（4）
C08G077/00（3） C08G077/08（3） C08G077/12（3）
C09D183/10（3） C08G077/16（2） C08G077/18（2）
C08G077/20（2） C08J003/24（2） C08L083/04（2）
C08L083/05（2） C08L083/07（2） C08L083/08（2）
发明人 FUJIMOTO T（5）
公开年 2022（5）
申请年 2020（4） 
专利权人 MOMENTIVE PE.（5）

One-component thermal-gel composition used for heat dissipating material for dissipating heat from substrate, comprises crosslinkable organopolysiloxane, hydrolyzable organopolysiloxane, thermal conductivity enhancing agent, organopolysiloxane, adhesion promoter, antioxidant, and pigment.

DUTTA P, DASGUPTA D, MS A, FUJIMOTO T, CHISATO H, ANJITHA M, HOSHINO C

Condensation curable composition used as article in aerospace device, electronic device, electronic component, automobile, insulation, coating, or solvent resistant membrane, comprises condensation curable organopolysiloxane, silicone-imide crosslinker, condensation cure catalyst and additive.

DEY K, MILLER C, KONWAR D B, RAJENDRA V, FUJIMOTO T, MANDAL S

Addition curable silicone-imide composition for cured silicone-imide material for e.g., aerospace device, comprises alkenyl functional siloxane-imide copolymer, alkenyl functional organosiloxane, polyorganohydrogensiloxane and catalyst.

MILLER C, NARAYANAN R, ZAMPELLA J, RAJENDRA V, FUJIMOTO T, MANDAL S

New siloxane-imide copolymer used in addition curable silicone-imide composition for cured silicone-imide material incorporated in an aerospace, electronic, automobile, insulation, coating, or solvent resistant membrane application.

NARAYANAN R, SUNAGA T, FUJIMOTO T, MANDAL S

Condensation curable composition for use in cured silicone-imide material for article in aerospace device, electronic device, electronic component, automobile, insulation, coating, or solvent resistant membrane, comprises silicone-imide base polymer, crosslinker, and condensation cure catalyst.

KONWAR D B, FUJIMOTO T, MANDAL S