国家/地区 美国（4） 中国（3） 台湾（3） 日本（2） 韩国（2） 世界知识产权组织（2）
IPC部 C（8）
IPC大类 C08（8）
IPC小类 C08G（8）
IPC H05K009/00（8）
发明人
公开年 2022（4） 2021（3）
申请年 2021（8）
专利权人

Composition useful in e.g. article, preferably flexible display device of electromagnetic wave shielding film and for transportation devices comprises graphene oxide, nano cellulose, reducing agent comprising hydroxy and amino group.

HONG S W, BAE S, HONG P H, LEE Y, HANUI K, CHOI K W, NO A

Electromagnetic interface (EMI) shielding material comprises polymer matrix and van der Waals material is embedded in polymer matrix, forming quasi-one-dimensional atomic threads, where van der Waals material is trichalcogenide compound.

KARGAR F, BALANDIN A A

Composition used in electronic component for shielding electromagnetic waves, comprises silver particles, resin and alkoxysilane compound.

TAKASHI Y, YONEDA T

Bio-resin composite for bio-foam material comprises a polymer matrix, a toughener, dispersed in the polymer matrix, and an antistatic agent, present at an interface between the polymer matrix and the toughener and/or present in the toughener.

LIOU S, LIU Y, CHENG S, CHANG S, LIAO S

Electromagnetic shielding polypropylene composition used for auto component products comprises metal-organic frameworks-porous carbon material, polypropylene resin, toughening agent, talcum powder and processing additive.

GUO W, XIONG Z, CHEN S, CHEN Y, LAI A, HE L, YE N, CHEN P, FU W

Microelectronic package used for electrical device e.g., handheld or mobile electrical device comprises a die, and package substrate which comprises electrostatic discharge protection material including electrically-conductive carbon allotrope and electrically-conductive polymer.

EID F, ELSHERBINI A A, ALEKSOV A, SWAN J M, STRONG V A

Preparing electromagnetic wave shielding thermoplastic polyurethane involves putting polytetramethylene ether glycol, butanediol, isocyanate, antioxidant, yellowing-resistant agent and catalyst into reaction vessel under heating.

HE P

Electronic device e.g. printed circuit board, comprises singulated carrier portion, substrate molded onto singulated carrier portion, and conductive traces disposed on substrate, where substrate comprises polymer composition that includes aromatic polymer and electrically conductive filler.

KIM Y S, JIN R