国家/地区 中国（15）
IPC部 C（15） B（2） H（2）
IPC大类 C08（15）
IPC小类 C08G（15）
IPC C08K009/06（15）
发明人 PENG X（2） YE L（2） ZHANG Q（2）
公开年 2016（15）
申请年 2016（15） 
专利权人 ANHUI GEOMAR.（2） SUZHOU FIRST.（2）

Bio-based thermoplastic polyurethane film useful in food packaging, comprises bio-based diisocyanate, bio-based polyol, alkyl chain extender, antioxidant, functional graphene oxide and modified potassium permanganate solution.

HE J, WANG Y

Preparation of functionalized graphene/phenolic resin used for friction material, involves uniformly mixing phenol and formaldehyde, adding functionalized graphene oxide, ultrasonically treating, adding catalyst, heating and reacting.

XIA T, GUO F, DAN X, HUANG J, ZHANG Q, SUN Z

Photo-curable resin material used in three-dimensional printing, comprises epoxy acrylic resin, active diluent, photoinitiator, additive, graphene and multi-walled carbon nanotubes, in specified weight ratio.

LI S

Friction material useful in heavy duty automotive brake pad, comprises e.g. phenolic resin, acrylic rubber, octylamine polyoctahedral silsesquioxanes, quartz fiber, aramid fiber, basic magnesium sulfate whisker and graphene oxide.

YANG G

Silane-modified geogrid comprises polytetrahydrofuran ether diol, hexafluoroacetylacetone, oxidized graphene, para-hydroxybenzoic acid, acetic anhydride, zinc acetate, 6-hydroxy-2-naphthoic acid, and high-density polyethylene.

YE L

Heat resistant high strength polyimide film comprises e.g. sulfur-containing diamine, 3,3',4,4'-biphenyltetracarboxylic dianhydride, 2,2-bis(3,4-dicarboxyphenyl) hexafluoropropane dianhydride, and graphene.

WEI S

Preparation of graphene-modified aqueous polyurethane for e.g. vehicle coating, involves adding polyol to reactor, distilling, adding polyisocyanate and catalyst, and adding alcohol chain extender and hydrophilic chain extender.

QIAN T, LIU H, LANG W

Hydrophobic soil screen comprises isothiazolinone, dodecyl dimethyl betaine, oxidized graphene, p-hydroxybenzoic acid, acetic anhydride, zinc acetate, hydroxyl-2-naphthoic acid and high density polyethylene.

YE L

Modified epoxy resin adhesive used in LED chip packaging comprises bisphenol A epoxy resin, m-phenylenediamine, oxidized graphene, nano zirconium oxide, carbon nanotube, silane coupling agent and aluminum isopropoxide.

QIN T

Graphene/polyimide nanocomposite material includes graphene powder, p-phenylenediamine, 4,4'-diaminobenzophenone, pyromellitic dianhydride, phenanthrene-1,8,9,10-tetracarboxylic dianhydride, N-methylpiperidine and montmorillonite.

PENG X, WANG F