国家/地区 世界知识产权组织（7）
IPC部 B（7）
IPC大类 C08（7）
IPC小类 C08G（7）
IPC B29C070/16（2） B29C070/38（2） B29C070/50（2）
B29C070/52（2） B32B018/00（2） C04B035/14（2）
C04B035/52（2） C04B035/524（2） C04B035/626（2）
C04B035/634（2） C04B035/653（2） C04B035/76（2）
C04B035/80（2） C04B035/82（2） C04B035/83（2）
发明人 BARSOTTI R（2） CALVIN M（2） DIPIETRO S G（2）
MINNICI K（2） REBER R（2）
公开年 2023（7）
申请年 2022（5）  2021（2） 
专利权人 ARKEMA FRANC.（2）

Production of high temperature composite e.g. carbon-carbon composite, involves pyrolyzing precursor portion produced from resin containing polyaryletherketone at preset conditions, infusing liquid resin and pyrolyzing, and repeating infusion and pyrolysis process.

BARSOTTI R, REBER R, CALVIN M, DIPIETRO S G, MINNICI K, CALVIN M K, BARSOTTI R J

Manufacture of high temperature composite e.g. carbon-carbon composite, involves forming precursor component from resin containing poly(aryl ether ketone) copolymer and reinforcing material, infusing liquid resin to component and pyrolizing.

BARSOTTI R, MINNICI K, DIPIETRO S G, CALVIN M, REBER R

Reversible adhesive material used in article, comprises polyurethane matrix i.e. formed from reacting isocyanate compound with Diels-Alder adduct, or Diels Alder adduct and polyol compound with isocyanate compound, and graphene particles.

SALAVAGIONE H J, SEYLER H, QUILEZDIAZ S, GARY ELLIS J, SHUTTLEWORTH P S, GOMEZFATOU RODRIGUEZ M, QUILESDIAZ S

Polyimide film used in multilayer film and flexible metal clad laminate, is obtained by imidizing polyamic acid solution containing dianhydride component including e.g. biphenyltetracarboxylic dianhydride, and diamine component including e.g. m-tolidine, and comprises graphene nanoplatelets.

JEON J, YEO M, BACK S, LEE K, CHUN J, BAEK S, LEE K N

Anion conducting copolymer used in anion exchange membrane, comprises poly(phenylene) backbone having 9H-fluorene structure, and pair of side chains extending from center ring to respective terminal group, and aromatic compound coupled to poly(phenylene) backbone.

QIUYING Z, BAMDAD B

Epoxy molding compound used in fluid ejection device for encapsulating fluidic dies, comprises hardener, inorganic based filler, catalyst to accelerate curing of epoxy molding compound, and conductive additive.

SONG B, ZHANG Z

Use of polyalkylene oxides which have aromatic radical as dispersant for graphene material.

LEHMANN K, SCHUMANN S, LEICH V, BREUERS V, HOENIG J, HELLMANN L, HOVEN T, SEIDENSTICKER P