国家/地区 韩国（15）
IPC部 C（15） B（5） H（3）
IPC大类 C08（15）
IPC小类 C08G（15）
IPC C08K003/013（15）
发明人 CHOI J Y（2）
公开年 2021（7） 2022（4） 2023（3）
申请年 2020（5）  2019（3）  2021（3）  2022（2） 
专利权人 EMSCHEM AG（2） KOREA RES IN.（2）

New ethynyl benzene-based crosslinking precursor used for copolymer of gel polymer electrolyte used in electrochemical device.

KIM T H, KIM S H, JANG J K, LEE J Y, JANG J G

Photocurable composite resin useful in preparation of additive, comprises metal particles, ceramic particles, and carbon-based particles and phenol novolac resin containing substituted tricyclic compound.

KIM H J, YANG S W

Preparing hydrogel for energy storage device, involves forming pre-gel comprising polymer and metal salt particles, shrinking and dehydrating pre-gel and impregnating shrunk and dehydrated pre-gel with ion solution to cross-link and rehydrate shrunk and dehydrated pre-gel to produce hydrogel.

JI D, KIM J Y, HWAN J D

Matter composition comprises epoxy functionalized two-dimensional shaped particles comprising functionalized graphene, clays, and alumina platelets, carbon nanotubes, epoxy resin, and curing agent comprising ionic liquid, and 1-ethyl-3-methylimidazolium dicyanamide.

KALB J, IFTIME G, WEI J, PANDEY R, RAHULPANDY, JUNHUA W, JAMIKALB

Compatibilizer useful in organic-inorganic composite material for molded article i.e. abrasive sand, comprises inorganic compound-hyperbranched polymer composite comprising inorganic compounds, and hyperbranched polymer.

JUNG S, PAGKHIMUN, CHOI J I, WOOK K D, JUNG H, LEE B

Polyamide molding composition used as a filled polyamide molding for producing moldings or components of automotive sector, comprises partially crystalline and aromatic polyamide, functionalized impact modifier, metallocene, and additive.

ALKAN A, CADALBERT A, BAYER A, HOFFMANN B, ALKANE A, DALBERT A, ALKA A

Producing polyimide aerogel used for three-dimensional model conveniently in various fields i.e. food, comprises e.g. preparing polyamic acid salt by dissolving diamine, dianhydride and tertiary amine-based photocuring agent in solvent.

CHUNG C M, CHOI Y J, CHOI J Y, JIN S W, PARK H J, SEUNGHYOUN L, LEE J S, LEE J, AHN H S, KIM D

Polymer composition used for forming substrate for electronic device, comprises liquid crystalline polymer, electroconductive filler, and mineral filler, and has preset surface resistivity.

KIM Y S, JIN R

Manufacturing thermoplastic resin-based thermally conductive masterbatch comprises performing in-situ polymerization by mixing thermal conductivity filler with solution containing thermoplastic resin monomer.

SOO P Y, HUHMONGYOUNG, KIM W, HAN W, KANG S B

Composition for forming composite material, comprises polyaryletherketone copolymer comprising polyetheretherketone containing structural unit and poly(ether diphenyl ether ketone) containing structural unit, and poly(etherimide).

RICH J, ELHIBRI M J, LEACH J, ELHIBRI M