国家/地区 韩国（9）
IPC部 B（9）
IPC大类 C08（9）
IPC小类 C08G（9）
IPC C08L101/00（9）
发明人 EMPARUZIA V（3） FARRUGIA V M（3） SIBANTIISWARISLISKA.（3）
SRISKANDAR S E（3） SRISKANDHA S E（3） CLARIDGE R（2）
公开年 2022（3）
申请年 2021（2）  2022（2） 
专利权人 XEROX CORP（3）

Polymer layer derived composition useful in a display device, comprises e.g. polyborondimethylsiloxane, benzoyl peroxide, fumed silica, glass fibers, glass powder, carbon nanotubes, graphene oxide, carbonyl iron, calcium carbonate, zinc oxide, silicone elastomer and polydimethylsiloxane.

HWANG S, LEE J, WU X, KIM J, KIM Y, SHIN H, YU W, YU W R, SHIN H J, SONG K Y, KIM J S, OH H J

Composition used for three-dimensional printing e.g. additive manufacturing, comprises particles comprising thermoplastic polymer grafted to carbon nanomaterial, and particles have preset aerated density.

FARRUGIA V M, SRISKANDHA S E, CLARIDGE R, SRISKANDAR S E, EMPARUZIA V, SIBANTIISWARISLISKANDA

Method for selective laser sintering for three-dimensional article, involves depositing carbon nanomaterial-graft-polyamide particles with other thermoplastic polymer particles, and exposing to laser to fuse polymer particles and form consolidated component by selective laser sintering.

SRISKANDHA S E, FARRUGIA V M, EMPARUZIA V, SIBANTIISWARISLISKANDA, SRISKANDAR S E

Selective laser sintering process for preparing highly spherical particles, involves depositing carbon nanomaterial-graft-polyurethane particles on nanomaterial surface and exposing nanomaterial grafted polyurethane particles to laser, for fusing polymer particles and forming consolidated body.

SRISKANDHA S E, FARRUGIA V M, CLARIDGE R, EMPARUZIA V, SIBANTIISWARISLISKANDA, EASWARI S, SRISKANDAR S E

Manufacturing thermoplastic resin-based thermally conductive masterbatch comprises performing in-situ polymerization by mixing thermal conductivity filler with solution containing thermoplastic resin monomer.

SOO P Y, HUHMONGYOUNG, KIM W, HAN W, KANG S B

Flexible, low shrinkage, conductive formulation for coating substrate of articles and filling gaps in electronic packages comprises sinterable, conductive metal particles, graphene, diluent, and polymer resin.

HONG X, SANCHEZ J G, CAO X, ZHUO Q

Method for forming high-strength graphene-reinforced polymer matrix composite for e.g. aircraft part for commercial application, involves applying succession of shear strain events to molten polymer phase.

NOSKER T, LYNCH J, KEAR B, HENDRIX J, CHIU G, ZHAO G, HENDRIKS J, NOSKER T J, LYNCHBRANZOI J K, KEAR B H

Manufacture of resin compound material involves uniformly dispersing carbon material having graphene structure in synthetic resin chosen from crystalline resin and non-crystalline resin under specified conditions.

SAWA K, TSUMURA K, INUI N, TAKAHASHI K, TANIGUCHI K

Polymer resin composition useful for manufacturing an insulating film for manufacture of a build-up multi-layered printed circuit board, comprises polymer resins, and graphene for linking the polymer resins with larger attraction.

LEE K S, HONG S S, LIM H H, LEE H Y, CHO J C, KYU S L, SANG S H, HYUN H L, HWA Y L, JAE C C, HONG S, LEE H, LEE K, LIN H, JO J, LIM H, CHO J