国家/地区 美国（8）
IPC部 C（8）
IPC大类 C08（8）
IPC小类 C08G（8）
IPC C08K003/04（5） H05K009/00（4） C08L067/04（3）
C08G063/06（2） C08G063/60（2） C08K003/08（2）
C08K003/34（2） H01B001/12（2） H05K001/03（2）
发明人 JIN R（2） KIM Y S（2）
公开年 2021（4） 2022（4）
申请年 2021（8）
专利权人 TICONA LLC（2）

Electromagnetic interface (EMI) shielding material comprises polymer matrix and van der Waals material is embedded in polymer matrix, forming quasi-one-dimensional atomic threads, where van der Waals material is trichalcogenide compound.

KARGAR F, BALANDIN A A

Composite particulate for lithium battery, has diameter and comprises anode active material particles that are dispersed in high-elasticity polymer matrix or encapsulated by high-elasticity polymer shell, and high-elasticity polymer comprises polymer derived from monomer selected from phosphates.

JANG B Z

Bio-resin composite for bio-foam material comprises a polymer matrix, a toughener, dispersed in the polymer matrix, and an antistatic agent, present at an interface between the polymer matrix and the toughener and/or present in the toughener.

LIOU S, LIU Y, CHENG S, CHANG S, LIAO S

Bio-electrode composition used in contact with skin of living body for detecting physical conditions such as heart rate, comprises (A) reaction composite comprising ionic polymer material and carbon particle.

HATAKEYAMA J, SHANRUN

Microelectronic package used for electrical device e.g., handheld or mobile electrical device comprises a die, and package substrate which comprises electrostatic discharge protection material including electrically-conductive carbon allotrope and electrically-conductive polymer.

EID F, ELSHERBINI A A, ALEKSOV A, SWAN J M, STRONG V A

Coating insulation component in high temperature, high voltage and/or corrosive environments, by applying coating of heat processing composition of crosslinkable aromatic polymer to exterior surface of insulation component and crosslinking.

DRAKE K A, SONG L, GAVLIK R, GABRIEL R

Electronic device e.g. printed circuit board, comprises singulated carrier portion, substrate molded onto singulated carrier portion, and conductive traces disposed on substrate, where substrate comprises polymer composition that includes aromatic polymer and electrically conductive filler.

KIM Y S, JIN R

Polymer composition used for forming substrate for electronic device, comprises liquid crystalline polymer, electroconductive filler, and mineral filler, and has preset surface resistivity.

KIM Y S, JIN R