国家/地区 日本（5）
IPC部 C（5） H（2）
IPC大类 C08（5）
IPC小类 C08K（5）
IPC C08K009/06（5）
发明人
公开年
申请年 2020（2） 
专利权人 FUJI POLYMER.（2）

Heat-conductive silicone heat radiation material used as thermal interface material between heating portion of electronic component and heat sink comprises silicone polymer, heat-conductive inorganic filler, and heat-resistance improver.

KOBAYASHI S, KIMURA Y, SHINGO K, YUKO K

Silicone resin composition used for composite material for heat conductive silicone sheet for electronic component, comprises silicone resin and heat resistance improving agent comprising organic polycyclic aromatic compound containing secondary amino groups and ketone groups in cyclic structure.

MAKOTO I, KATSUYUKI S, YUJI N, IWAI M, SUZUMURA K, NAKAJIMA Y, NAKASHIMA Y

New modified graphene used for forming modified graphene-resin composite and modified graphene dispersion, has preset ratio of intensity of G band with respect to intensity of D band in Raman spectroscopy spectrum.

WATANABE T, KITAO A, SUZUKI K, KOBAYASHI Y, WATANABE D, KOBAYASHI A

Polypropylene-graphene composite material for e.g. vehicle component, comprises polypropylene substrate, and organic graphene oxide masterbatch obtained by reacting modified graphene oxide with maleic anhydride-grafted polypropylene.

KONG N K, KIM H S, LEE J H, LEE B C, OH Y S, PARK S Y, CHOI S M, WOO J H, KIM H, WU Y, KONG L, LEE J, LEE B, CUI C, PIAO X, YU C

Fluoropolymer composition for forming composite layer used for articles, comprises liquid continuous phase, and composite particles dispersed in liquid continuous phase and containing fluorosilane-treated graphene-comprising particles.

ZHANG Q, QI Y, DOOLEY B, HU N