国家/地区 中国（97） 美国（11） 世界知识产权组织（11） 日本（9） 韩国（8） 台湾（6） 欧洲专利局（EPO）（5）
IPC部 C（105）
IPC大类 C08（105）
IPC小类 C08L（105）
IPC C08L063/00（105）
发明人 WANG Y（6） LI J（5） ZHANG J（5）
FENG W（4） HE J（4） LIANG S（4）
LIU J（4） SITU R（4） WANG J（4）
DAI M（3） GU J（3） LI Z（3）
LIANG C（3） WANG H（3） WANG S（3）
公开年 2018（23） 2021（20） 2017（13） 2023（11） 2022（10） 2020（9） 2019（5） 2012（3） 2015（3） 2016（3） 2013（2）
申请年 2017（19）  2020（15）  2021（15）  2022（13）  2018（12）  2019（11）  2016（8）  2011（2）  2012（2）  2013（2）  2015（2） 
专利权人 SAMSUNG ELEC.（3） UNIV NORTHWE.（3） CHANGSHU SHE.（2） ENN GRAPHENE.（2）
FENG W（2） GUANGDONG SH.（2） HONG H（2） HUIZHOU BRD .（2）
ITEQ WUXI EL.（2） KE L（2） KYOCERA CORP（2） LIANG S（2）
SHENGYI TECH.（2） SHI Z（2） SITU R（2） SUZHOU NANER.（2）
UNIV SHANGHA.（2） UNIV ZHEJIAN.（2） YAO J（2） YIN J（2）

Electromagnetic interference suppressing material used as radio wave absorber, noise suppression sheet, semiconductor sealing material, sealing sheet, and wire coating material, comprises base material containing organic substances and inorganic substances, and powdered carbon material.

NISHIHARA H, YOSHIDA S, UCHIDA K

High-strength polyethylene foamed cable material comprises e.g. polyethylene foam material, low-density polyvinyl chloride resin, additive, polyvinyl chloride resin micropowder, foaming agent, epoxy resin filler, nano-polytetrafluoroethylene powder, and reducing agent.

LUAN R, WANG S

Resin composition used for preparing low-flow glue prepreg for rigid-flexible combined printed circuit board, comprises epoxy resin, epoxy curing agent, curing accelerator, carboxy-terminated nitrile rubber, and oxazoline compound.

ZHANG W, CHEN C, HE J

Resin composition useful in preparing low-flow adhesive prepreg comprises epoxy resin, epoxy curing agent, curing accelerator, carboxylated nitrile rubber, carbodiimide compound.

ZHANG W, CHEN C, HE J

Grounded resistance-reducing material is prepared from resin, conductive agent, corrosion inhibitor, curing agent, filler, and water.

JIA Z, AI X, LEI S, ZHANG H, WANG Y, JIA Y, WU L, WANG S, LI G, LI P, WANG J, ZHANG L, HE J, GAO Y, LI C, WANG G, ZHAO G, WANG X, DI L

Preparation of electrothermal carbon fiber composite material based on crosslinking reinforcement by coating graphene oxide aqueous solution on surface of carbon fiber, carbon fiber yarn or carbon fiber fabric as base material, and forming composite material by vacuum-assisted resin transfer molding.

DAI M, HONG X

Preparing electromagnetic shielding carbon fiber fabric composite material based on reduced graphene oxide reinforcement useful for e.g. military anti-radar radome, comprises making reduced sample into electromagnetic shielding carbon fiber fabric composite material.

DAI M, HONG X

Preparation of graphene oxide thermally conductive film by dispersing graphene oxide, nanocellulose and polysorbate 20 in deionized water, adding aqueous-based epoxy resin and curing agent to disperse, forming layer of graphene oxide, and coating slurry gel system thermally conductive film.

CHEN D

Heat dissipation adhesive sheet useful in electronic components e.g. semiconductors, or PC boards comprise metal thin film layer formed on lower surface of heat dissipation layer, and adhesive layer on metal thin film layer.

HUN L S, SONG J, KWON H J, CHOI S, YUMINSOOK, YOUK S K

Foam electromagnetic shielding material with bulletproof function used in stealth airplanes, is prepared by superposing coated aramid fiber laid fabric blocks to obtain bulletproof aramid fiber chips to obtain foam electromagnetic shielding material precursor, and heating.

FU L, PAN Z, WU Z, LIU Y, FANG X, CUI Z, LI Z, XU D, AI Q, HU L, LI N, CHEN H