国家/地区 中国（7）
IPC部 C（7）
IPC大类 C08（7）
IPC小类 C08K（7）
IPC C08K003/04（7）
发明人 ZENG G（7） LI Z（2）
公开年 2016（4） 2018（3）
申请年 2015（4）  2017（3） 
专利权人 UNIV HUNAN TECHNOLOGY（7）

Preparing electronic element plastic board comprises e.g. dispersing graphene oxide, maleic anhydride, poly-4-methyl-1-pentene and initiator, melt-blending, adding metal compound flame retardant, silane coupling agent and melt-blending.

ZENG G, ZHANG Y, LI Z

Preparation of plastic involves mixing graphene, maleic anhydride, high-density polypropylene and initiator, ultrasonically dispersing material and then placing in twin screw extruder, mixing silane coupling agent and dispersant and drying.

ZENG G, LI Z, CHEN Y

Preparation of plastic involves weighing graphene oxide, dispersant, maleic anhydride, high-density polypropylene and initiator and then melting, adding dispersant, anhydrous ethanol, lubricant and antioxidant and leaving and melting.

ZENG G, LIU W, LIU S

Aluminum nitride/graphene composite thermally conductive silicone grease includes dimethyl silicone oil, modified aluminum nitride/graphene composite thermally conductive filler and gamma-methacryloxypropyltrimethoxysilane (KH570).

ZENG G

Composite thermal grease comprises silicone oil, modified spherical aluminum oxide/corundum/graphene complex thermally conductive filler, silane couple agent thermally conductive filler, silicone oil crosslinking agent and antioxidant.

ZENG G

Silicon dioxide/graphene/graphite composite heat-conducting silicone grease contains silicone oil, modified silicon dioxide/graphene/graphite compound thermal conductive filler, thermal conductive filler coupling agent and antioxidant.

ZENG G

Composite thermal grease comprises silicone oil, modified silicon carbide/zinc oxide/graphene composite conductive filler, coupling agent of thermally conductive filler, crosslinking agent, silane surfactant, and antioxidant.

ZENG G