国家/地区 中国（6） 欧洲专利局（EPO）（2） 日本（2） 韩国（2） 美国（2）
IPC部 C（8）
IPC大类 C08（8）
IPC小类 C08K（8）
IPC C08K003/24（8）
发明人 ZHANG C（2）
公开年 2022（4）
申请年 2021（3）  2022（2） 
专利权人

Preparing polyvinylidene fluoride piezoelectric film casting having ultra-thin thickness useful in the technical field of preparing piezoelectric film casting, comprises e.g. adding calcium titanate, performing surface hydrophilic treatment, stretching, cutting and sending to polarization process.

WEI S, LIU Y, ZHANG C, GUAN T

Preparing double-layer flexible composite film with strong microwave absorption performance, comprises e.g. adding ferric chloride hexahydrate and nickel chloride hexahydrate into graphene oxide suspension, adding aqueous ammonia, heating, stirring, and mixing with aqueous polyurethane emulsion.

WU H, WAN J, RUAN S

Bio-electrode composition used in contact with skin of living body for detecting physical conditions such as heart rate, comprises (A) reaction composite comprising ionic polymer material and carbon particle.

HATAKEYAMA J, SHANRUN

Preparing bismuth vanadate/3D graphene foam/acrylic boron isobornyl ester polymer-based composite coating material, comprises placing bismuth vanadate/3D graphene foam into anhydrous ethanol solution, heating, adding pyridine triphenylborane and ultrasonically dispersing.

SONG D, LIU Q, LIU J, YU J, ZHU J, LIU P, WANG J, ZHANG L, CHEN R

Preparing high-performance three dimensional printed piezoelectric piece, comprises preparing polymer and ceramic materials into polymer/ceramic piezoelectric composite powder, coating and performing selective laser sintering.

CHEN N, CHEN F, WANG Q, LI Y, ZHANG C, ZHANG X

Glass-fiber-reinforced PA66 power hardware material contains PA66, glass fiber, melamine cyanurate, zinc borate, aluminum hypophosphite, bamboo charcoal, carbon fiber, silicone rubber, aqueous polyurethane, and graphene oxide.

YU W, MA S

Preparing graphene dried powder used for coating e.g. gold and glass surfaces, involves sonicating graphite in mixture of water and volatile organic solvent, centrifuging, filtering, and adding precipitating agent to solution.

MIRANDA SORIANO R, ZAMORA ABANADES F J, MASBALLESTE R, AZANI M, CARCELEN VALERO V, DOBLARE CASTELLANO M, CASTELLANO DOBLARE M

Semiconductor sealing material composition used as packaging material to protect electronic part e.g. diode comprises epoxy resin; hardener; curing catalyst; additive such as coupling agent; and nano-graphene plate powder as filler.

CHOI S, PARK S, CHOI S H, PARK S H, HONG C S, HUI P S