国家/地区 中国（7） 世界知识产权组织（2）
IPC部 C（7）
IPC大类 C08（7）
IPC小类 C08K（7）
IPC C08K003/04（7）
发明人
公开年 2021（2）
申请年 2020（2）  2022（2） 
专利权人

Electronic device such as chip, comprises electronic component, heat sink in which surface its is provided with magnetic layer containing permanent magnetic material, and composite thermal-conductive material comprising organic matrix and ferromagnetic particles.

FANG H, XU Y, ZHENG K

Heat-conducting and wave-absorbing nano-grade composite material for function-wide frequency spectrum, comprises heat conducting alumina powder, absorbing powder, medium ceramic powder, graphene, cross-linking agent, curing agent, catalyst, curing delay agent and rest of silicone oil carrier.

DENG S

Heat-resistant and impact-resistant modified polypropylene power tube has compartment formed on inner side of inner tube between every two heat conducting plates, and rolling balls arranged on inner side of inner tube in compartment.

TAN Z

Silica gel composite material comprises magnetic and heat-conducting wave-absorbing material formed by oriented arrangement of magnetic boron nitride nanosheets, thermally conductive powder, and MXene nanosheets as raw materials.

CAO Y, YANG S, XIE Y, CHEN Y, FANG X, CHEN K

Heating paste comprises graphene, carbon black, synthetic resin, metal powder, antistatic agent, dispersing agent, thickening agent, solvent, curing agent and titanate coupling agent.

CHEN X, MENG J, ZHANG L

Flexible, low shrinkage, conductive formulation for coating substrate of articles and filling gaps in electronic packages comprises sinterable, conductive metal particles, graphene, diluent, and polymer resin.

HONG X, SANCHEZ J G, CAO X, ZHUO Q

Thermal conductive composite material for electronic equipment, contains silica gel, ethylene/butylene terephthalate copolymer, graphene, aluminum powder, polyethylene glycol, titanium dioxide, amylopectin, and antioxidant.