国家/地区 中国（72） 世界知识产权组织（8） 韩国（6） 美国（6） 日本（3） 欧洲专利局（EPO）（2） 印度（2） 台湾（2）
IPC部 C（80） B（8） H（8）
F（4） G（3）
IPC大类 C08（80）
IPC小类 C08K（80）
IPC C08K009/02（80）
发明人 GUO Y（6） LIU Y（5） WANG Y（5）
LIU Z（4） ZHANG B（4） CHEN J（3）
LIU D（3） ZHANG H（3） ZHANG X（3）
CHEN D（2） CHEN F（2） CHEN G（2）
CHEN M（2） CHEN Z（2） CHENG H（2）
公开年 2018（16） 2021（16） 2017（11） 2022（11） 2020（10） 2016（5） 2023（3） 2012（2） 2019（2）
申请年 2020（18）  2017（12）  2018（11）  2022（10）  2021（8）  2016（6）  2019（5）  2015（4）  2011（2）  2013（2） 
专利权人 WUHU YUANKUI.（3） ELEMENT CO L.（2） NINGBO INST .（2） UNIV GUANGDO.（2）
UNIV SHANGHA.（2）

Heat-conducting gel used for heat dissipation of electronic device, comprises silicone oil matrix, bisphenol-A-type epoxy resin and heat-conducting filler comprising modified graphene, modified diamond and modified carbon nanotubes, where surface of modified graphene is modified with amino group.

HE Y, LIU F, YU G

Polydimethylsiloxane composite for heat dissipation/flame retardancy in field of automobiles and electrical/electronic comprises metal hydroxide-coated carbon body as filler based on polydimethylsiloxane.

SHIM S E, HWANG S, SO J, LEE K

Polyurethane high-thermal conductivity film used as photothermally controllable film, is prepared by reacting three-dimensional carbon composite powder and thermoplastic polyurethane, concentrating obtained three-dimensional carbon/polyurethane assembly, dripping on substrate and heat-treating.

CHEN J, WANG C, LI H, LUO W

Graphene-ceramic heat dissipation material with improved electrical insulation and resin miscibility comprises first dispersion solution is dispersed and second dispersion solution in which ceramic heat-dissipating filler is pulverized.

KYOUNGJEONGBAE, CHO J I, YANG H J, SONG H, SU Y C

Producing graphene-ceramic heat dissipation material with improved electrical insulation and resin miscibility, comprises preparing first dispersion solution by dispersing graphene interlayer material in aqueous solvent.

KYOUNGJEONGBAE, SU Y C

Thermally conductive composition used in thermally conductive material for electronic devices for e.g. printed wiring board, transistors, driver integrated circuit chips, and memories, comprises resin, and carbon-based material whose surface is coated with inorganic substance.

KASUE A

Composite powder for heat dissipation coating, includes graphene and silicon dioxide microsphere, where graphene and silicon dioxide microsphere are combined together through chemical bond, graphene has preset average transverse size, and silicon dioxide microsphere has preset particle size.

HE P, DING G, ZENG X

Preparation of heat-conducting composite material for use as e.g. filler, involves preparing eutectic solution, performing high-speed shearing stress treatment of prepared dispersion liquid twice to obtain nano hexagonal-boron nitride, and preparing hydroxylated nano hexagonal-boron nitride.

LIU N, HUANG Y, FANG C, CUI Y, LI S

Preparing thermally conductive filler for highly thermally conductive elastomer comprises e.g. adding composite thermally conductive material and grafted graphene oxide to mixed solvent of ethanol and water, ultrasonically dispersing, grinding, transferring to reaction vessel, and precipitating.

LIU Y, ZHONG R, LI T

Graphene-modified polyvinylidene fluoride based on silver modification is characterized in that it is polyvinylidene fluoride modified with silver nanoparticles supported on graphene.

CHEN J, ZHOU H, YE K, WANG C, WANG X, XU Z, BAI J, MAO C