国家/地区 中国（16） 世界知识产权组织（4） 美国（2）
IPC部 C（18） B（3） F（3）
IPC大类 C08（18）
IPC小类 C08K（18）
IPC C08K009/02（18）
发明人 CHEN Z（2） LIU Y（2）
公开年 2021（12） 2020（6）
申请年 2020（18）
专利权人

Preparing modified graphene used for preparing thermally conductive polybutylene terephthalate material, involves adding graphene to hydrochloric acid, performing ultrasonic filtration, and adding concentrated hydrochloric acid.

JIANG C, ZOU C, YAO C, WU A, YANG G

Infrared absorbing composition used in device, in layered structure as infrared emitter/absorber, to prepare surface to absorb infrared radiation and making coatings comprises layer of metal carbides and nitrides material.

HAN M, GOGOTSI Y

High heat-conducting graphene floor heating pipe comprises pipe body, polyethylene layer, steel wire net layer, and graphene heat-conducting layer including graphite, antioxidant, dispersant, coupling agent, heat stabilizer, and plasticizer.

XU W, LIU Y, ZHANG H

Modifying graphite powder useful for preparing polyolefin-based graphite orientation-type thermal interface material, comprises e.g. performing plasma etching pretreatment on graphite powder, and subjecting to hydroxylation treatment.

ZENG X, ZHANG C, YE Z, REN L, ZHANG Y, XU J, SUN R

Preparing recyclable wear-resistant and high thermal conductivity nylon 66 composite material involves weighing nylon 66 resin, graphene microchips, modified nano-silica, compatibilizer, antioxidant, silane coupling agent, carbon fiber.

XIE F, ZHENG J, LIU M, LI J

Preparing degradable high thermal conductivity composite material comprises uniformly mixing heat conducting filler, chitosan microsphere and acid aqueous solution, then drying and forming.

GAI J, ZOU Q, XIONG S, JIANG M, ZHENG K

High thermal conductivity carbon fiber composite material with laminated hybrid structure comprises combination of carbon fiber cloth layer, sheet filler thermal conductivity network, and sheet sandwich ball laminated structure.

WANG H, SUN X, ZHANG J, MA C, LU N, ZENG Y, REN W, LIU C, CHENG H

Graphene-based modified composite material comprises single-layer graphene powder, carbon nanotubes, hydrogen-boron nitride material, urea, zinc oxide, liquid rubber, thermoplastic resin, initiator and MXene.

HUANG Z

High thermal conductivity reinforced polyphenylene sulfide composite material comprises polyphenylene sulfide substrate, surface carbonization reinforcement and thermally conductive filler.

ZHOU G, YIN H, CHEN Z, HAN Y, SHEN J, DENG H, ZHOU Y

Manufacture of heat-dissipating composite material used for electronic device, involves e.g. mixing inorganic binder and filler to prepare mixture, heat-treating obtained mixture, and mixing composite particles and polymer material.

CHOA Y H, RYU S H, LIM M S, CHO H B, SONG Y S, CHOA Y, LIMMINSUP, CHO H, SONG Y