国家/地区 中国（6）
IPC部 C（8） B（2）
IPC大类 C08（8）
IPC小类 C08K（8）
IPC C08K009/02（8）
发明人 CHEN F（2） LIU D（2）
公开年 2021（4） 2022（3）
申请年 2021（8）
专利权人

Polydimethylsiloxane composite for heat dissipation/flame retardancy in field of automobiles and electrical/electronic comprises metal hydroxide-coated carbon body as filler based on polydimethylsiloxane.

SHIM S E, HWANG S, SO J, LEE K

Composition comprises poly(arylene ether), where poly(arylene ether) is polymeric reaction product of one disubstituted benzophenone and polyol and one polyol comprises one fluorinated diol.

CONNELL J W, BELCHER M A, GHOSE S

Preparing high thermal conductivity composite material comprises e.g. oxidizing graphene and silicon carbide nanowire with hydrogen peroxide to obtain oxidized graphene and oxidized silicon carbide, and reacting graphene oxide and oxidized silicon carbide with silane coupling agent.

ZHOU L, ZHAO F, WANG B, WANG F

Graphene/liquid crystal epoxy resin high thermal conductivity composite material comprises liquid crystal epoxy resin, liquid crystal functionalized magnetic graphene and curing agent.

WANG Z, ZHANG X, ZHAO Q, ZHANG T, CHEN F

Preparing nylon 6 base heat conducting material based on additive manufacturing, comprises e.g. processing surface of heat-conducting filler, designing three-dimensional computer-aided design model, paving nylon 6 composite powder, sintering and cooling.

LIU D, YUAN Y, WU W, HU H

Polymer complex material with excellent heat conducting performance, and flame retardant property comprises thermoplastic polymer resin, intumescent flame retardant, synergistic flame retardant and thermal conductive filler.

DING P, CHEN F, WANG J

Preparing high heat dissipation, conductivity and strength graphene polyurethane rigid closed-cell foam material comprises taking chemical surface hydrophobically modified graphene nano sheets in foam.

DENG C, XIAO S

High heat-conducting four-needle-shaped composite particle/polyimide film useful in electronic materials e.g. thermal management materials and interface materials, comprises heat-conducting filler, surfactant and polyamic acid solution.

MA C, CHI H, LIU D, ZHANG P, DAI P