国家/地区 中国（6） 世界知识产权组织（2）
IPC部 C（6）
IPC大类 C08（6）
IPC小类 C08K（6）
IPC C09K005/14（6） C08K003/04（5） C08K003/08（3）
C08K007/00（3） C08L063/00（3） C08K003/38（2）
C08K007/18（2） C08K009/00（2） C08K009/06（2）
发明人 SUN R（6） ZENG X（4） XU J（3）
REN L（2） YE Z（2） ZHANG C（2）
ZHANG Y（2）
公开年 2017（2） 2021（2）
申请年 2016（2）  2020（2） 
专利权人 SHENZHEN INST ADVANCED TECHNOLOGY（6）

Preparing porous framework with double interlaced network used as heat conductive filler in heat interface material by mixing filler, binder and water, ball milling, placing polytetrafluoroethylene mold on copper column, adding porous framework and filler mixture, filtering, drying and sintering.

XU J, SUN R, ZENG X, YAO Y

Preparation of graphite oriented thermal interface material involves mixing raw material components of graphite oriented thermal interface material, orienting, freezing, cutting, performing high temperature curing treatment and cutting.

ZENG X, ZHANG C, YE Z, REN L, ZHANG Y, XU J, SUN R, ZHAGN Y

Modifying graphite powder useful for preparing polyolefin-based graphite orientation-type thermal interface material, comprises e.g. performing plasma etching pretreatment on graphite powder, and subjecting to hydroxylation treatment.

ZENG X, ZHANG C, YE Z, REN L, ZHANG Y, XU J, SUN R

Graphene microsphere/epoxy resin composite material has hexagonal honeycomb structure, and includes graphene microspheres, epoxy resin and curing agent.

ZENG X, LI C, SUN R, ME Y

Thermal conducting composite material useful in printed circuit board circuit board and electronic packaging thermal interface materials and other fields, comprises graphene/copper composite material as thermally conductive filler.

SUN R, LIU S, FU X

Graphene-boron nitride composite material useful as filler for preparation of thermally conductive film, has graphene sheets, boron nitride sheet and polydopamine linked between graphene sheets and boron nitride sheet as bridge molecule.

ZHU P, GAO Y, SUN R