国家/地区 中国（72） 世界知识产权组织（6） 美国（4） 日本（3） 欧洲专利局（EPO）（2） 韩国（2） 台湾（2）
IPC部 C（81） H（14） B（6）
IPC大类 C08（81）
IPC小类 C09K（81）
IPC C09K005/14（81）
发明人 LI Z（5） HU J（4） LIU W（4）
LIU Y（4） GE X（3） HUANG Y（3）
LI J（3） LI X（3） LIU P（3）
PAN Z（3） WANG H（3） WANG L（3）
WANG X（3） WU W（3） YANG S（3）
公开年 2022（81）
申请年 2022（46）  2021（28）  2020（7） 
专利权人 CHINA PETROL.（4） HANGZHOU FUX.（4） SINOPEC BEIJ.（4） ANHUI AEROSP.（3）
UNIV EAST CH.（3） ELEMENT CO L.（2） L P PROPERT.（2） UNIV ANHUI（2）
UNIV SOUTH C.（2） UNIV ZHONGSH.（2）

Preparing thermal conductive composite film comprises graphitizing carbon nano-tube, processing carbon nano-tube into fatty acid, mixing with graphene, ball milling carbon nano tube-graphene, grinding, filtering, drying, rolling and forming.

LIU P

Preparation of composite heat-conducting pad involves cutting planar high-thermal conductivity film material into fibers, filling gaps between high-thermal conductivity fibers with organic matter, and slicing obtained composite block in direction perpendicular to high-thermal conductivity fibers.

HUANG K, QIN F, WEI T

Thermally conductive, electrically insulating film used in electronic products and devices, comprises thermoplastic resin, and thermally conductive filler comprising thermally conductive carbon-based filler, thermally conductive metal oxide or hydroxide filler and thermally conductive ceramic filler.

MENG F

Flexible heat-conducting pad comprises liquid metal, solid heat-conducting filler and polymer, and is prepared by pouring liquid metal int polymer, stirring under air environment, dispersing liquid metal uniformly in polymer, and adding solid heat conducting filler into polymer.

CAO B, ZHANG X

Folding, bending and stretching flexible high heat conducting film useful in chips, comprises graphene-based materials, acrylate group, film-forming auxiliary agent and heat-conducting filling material comprising graphene oxide, aluminum nitride or boron nitride or aluminum nitride and boron nitride.

ZHAO L, ZHANG L

Graphene-ceramic heat dissipation material with improved electrical insulation and resin miscibility comprises first dispersion solution is dispersed and second dispersion solution in which ceramic heat-dissipating filler is pulverized.

KYOUNGJEONGBAE, CHO J I, YANG H J, SONG H, SU Y C

Producing graphene-ceramic heat dissipation material with improved electrical insulation and resin miscibility, comprises preparing first dispersion solution by dispersing graphene interlayer material in aqueous solvent.

KYOUNGJEONGBAE, SU Y C

Preparing high thermal conductivity insulating silica gel, comprises e.g. coating liquid silica gel on both sides of layer of fluorinated graphene membrane, coating liquid silica gel on another layer of fluorinated graphene membrane and curing.

PAN Z, ZHOU M

Thermally conductive composition used in thermally conductive material for electronic devices for e.g. printed wiring board, transistors, driver integrated circuit chips, and memories, comprises resin, and carbon-based material whose surface is coated with inorganic substance.

KASUE A

Heat-conducting and wave-absorbing integrated flexible material useful in the field of electronics, communications, automobiles, medical appliances, household appliance products, aerospace, security monitoring and navigation.

WU W, YAO Q, WU L, YANG X, TONG G