国家/地区 中国（25） 美国（2）
IPC部 C（27） H（7） B（3）
IPC大类 C08（27）
IPC小类 C09K（27）
IPC C09K005/14（27）
发明人 CHEN J（3） WANG S（3） WU X（3）
CHEN C（2） FENG Y（2） JIANG X（2）
LI H（2） LIN Y（2） LIU H（2）
LUAN Y（2） WANG D（2） WANG J（2）
XIANG L（2） YANG L（2） ZHAO J（2）
公开年 2023（27）
申请年 2022（22）  2023（3）  2021（2） 
专利权人 CHANGZHOU WI.（2） DONGGUAN JIA.（2） UNIV BEIJING.（2） UNIV JILIN（2）

Preparing graphene heat-conducting silicone grease comprises e.g. adding graphite into ultrapure water, stirring, using mechanical stripping process to obtain graphene slurry, filtering to get filter cake, adding transfer solvent, stirring, and utilizing transfer solvent to wash graphene slurry.

MA Y, LI Y, FENG J, LI X, LIU H

Preparing chitosan modified boron nitride and graphene fiber composite material useful for thermal conductivity modification of epoxy resin, comprises e.g. dissolving chitosan in acetic acid solution, adding phytic acid solution containing choline chloride, adding boron nitride and centrifuging.

ZHANG Q, WANG S

Preparing high thermal conductivity and low dielectric epoxy composite material used in electronic packaging field, involves preparing polyimide, dispersing polyimide microspheres and low-dimensional thermally conductive insulating fillers in solvent, mixing polyimide microsphere with epoxy resin.

ZHONG R, LIANG J, CAI H, TU S, HU D

Highly flexible thermal gasket, comprises vinyl silicone oil (e.g. vinyl-terminated polydimethylsiloxane), hydrogen-containing silicone oil (e.g. terminal hydrogen-containing silicone oil), thermal conductive filler (e.g. alumina), catalyst, coupling agent, and inhibitor.

LIN Y, CHEN D, LIU W, XIANG L, JIANG X

Thermally conductive material comprises base polymer, ethylene methyl acetate, graphite fibers and bis(2-ethylhexyl) adipate.

PARE R, KAMAVARAM V

Preparing high thermal conductivity insulating polyvinyl butyral intermediate film, comprises e.g. adding few-layer graphene and dispersant into solvent, using high-shear equipment to stir, adding hexagonal boron nitride, silane coupling agent hydrolysis liquid, and polyvinyl butyral, and stirring.

BOHM S, XIAO F, LIU S, QIAO S, RONG C, FENG D

Preparing three dimensional thermally conductive skeleton/polyimide thermally conductive composite material comprises subjecting thermally-conducting porous material soaked by polyamic acid solution, performing freeze drying and phase conversion treatment to thermally-conducting porous material.

CHEN C, ZHAO X, ZHOU H, ZHAO J, YANG L, WANG D

Heat conducting filler master batch used in polypropylene composite material for extruding and absorbing plastic and preparation of electronic components, comprise high pressure polyethylene, aluminum oxide, graphene, coupling agent, dispersant, and antioxidant.

CHEN P, XU H, SHE H, HUANG F, CHEN X, GONG W

Heat-conducting gel used for heat dissipation of electronic device, comprises silicone oil matrix, bisphenol-A-type epoxy resin and heat-conducting filler comprising modified graphene, modified diamond and modified carbon nanotubes, where surface of modified graphene is modified with amino group.

HE Y, LIU F, YU G

Preparing graphene/zirconium-BDC-metal-organic framework/perovskite quantum dot high thermal conductivity composite material comprises e.g. dispersing quantum dots in toluene, taking zirconium oxychloride octahydrate, washing, placing sodium nitrate into beaker, adding sulfuric acid and compounding.

WANG S, LUAN Y