国家/地区 中国（86）
IPC部 B（86）
IPC大类 B32（86）
IPC小类 B32B（86）
IPC C08K003/04（66） B32B027/32（34） B32B033/00（34）
C08J005/18（33） B32B009/04（28） B32B009/00（27）
B32B027/08（27） B32B027/06（25） B32B027/18（25）
B32B027/20（25） B32B037/10（22） C08L023/06（20）
B32B027/30（19） C08K003/22（19） B32B007/12（18）
发明人 LIU J（8） LIU Y（6） JIA L（5）
TIAN X（5） ZHANG J（5） CHEN X（4）
LI Y（4） LI Z（4） LIAO G（4）
WANG C（4） WANG F（4） WANG L（4）
WANG X（4） ZHANG H（4） CHEN Z（3）
公开年 2021（66） 2020（15） 2022（5）
申请年 2020（86）
专利权人 XIAMEN CHANG.（5） ANHUI GLANT .（4） CHANGCHUN AP.（3） HUBEI TIANYU.（3）
HANKOOK ALUM.（2） HUBEI FIRSTA.（2） INST METAL R.（2） KOREA ALUMIN.（2）
UNIV SHANGHA.（2）

Preparing heat-pressing molding foam absorbing material involves mixing raw materials comprising components, foam type surfactant, wave absorbing agent, catalyst and water to form to-be aggregate raw material, where wave absorbing agent is carbon black, graphite, carbon nano tubes and graphene.

YANG R, ZHAO Z, LIU R

Preparing black master batch for thin film soft package useful for thin film soft package used for lithium-ion pouch cell, comprises using double-screw extruder under special screw thread and component screw combination condition.

CHEN X, LI Z, JIA L, LIN X, LIAO G

Halogen-free low-dielectric epoxy resin composition useful in laminated plate and printed circuit board, comprises e.g. dicyclopentadiene epoxy resin, cresol novolac epoxy resin, maleimide resin, and 9,10-dihydro-9-oxa-10-phosphaphenan-threne-10-oxide-bisphenol phenolic resin hardener.

CHEN K, YU D

Antistatic polyethylene composition comprises polyethylene base resin and edge-modified grapheme.

YIN H, ZHANG Q, YANG L, GAO D, ZHANG S, LI J, LIN H, WANG X, XU Y, LV M, GUO P

Polyethylene composite material useful in preparation of packaging productscomprises linear low-density polyethylene, high density polyethylene, metallocene polyethylene and carbon material.

WANG H, ZHANG H, WANG M, WU R, ZHANG B, XU Y

Resin composition used to prepare prepreg for metal-clad laminate for preparing printed circuit board, comprises bismaleimide compounds and vinyl-containing elastomer.

CHIANG J, CHIOU J, LIU S

Fiber polymer composite used for forming reinforced articles such as flexible tapes for e.g. car doors, mud guards, bumpers and engine covers, comprises fibers of material and matrix material which is in direct contact with at least some of fibers and comprising amorphous poly-(alpha)-olefin.

CEPA S, KARGERKOCSIS J, BARANY T, VARGA L J, BABIK S, MONDRZYK S, SPITZER U, EBBERS A, KARGERKOCSIS A, KARGERKOCSIS V, JOSEPH K, BARANITAMAS, BARGARASLOJOZEF, CHICJABRINA M, SPITZERUDO

Water and gas barrier coating comprises polymer having amine, hydroxyl, and carboxylic groups and graphene.

XU C

Coated polyamide film used for aluminum-plastic composite film flexible package, comprises coating layer that is formed by coating surface of polyamide substrate layer with acrylic coating liquid including silicone-modified acrylic resin, crosslinked polymethylmethacrylate powder and water.

LIU Y

High thermal conductivity composite film used for, e.g. aerospace comprises premixed material layer comprising thermally conductive filler, auxiliary agent and adhesive, and in-plane reinforcement layer.

DUAN C, LIU J, WANG Q, ZHENG D, LIANG W, XU W