国家/地区 台湾（7）
IPC部 C（7） B（4） A（3）
H（3） D（2） G（2）
IPC大类 C08（7）
IPC小类 C08K（7） C09D（7） C08J（5）
C08L（5） C01B（4） A41D（2）
A61B（2） B01F（2） B82Y（2）
D06N（2） H01B（2）
IPC C09D201/00（7）
发明人 HSIEH C（3） WU M Y（3） CHEN J（2）
WU Y（2） XIE C（2）
公开年 2019（2） 2021（2）
申请年 2021（2） 
专利权人 ENERAGE INC（3）

Water absorbing, electrically conductive composition used as sensor for erosion and/or corrosion monitoring, comprises water soluble and/or water swellable and/or water absorbing resin, electrically conductive filler, and solvent.

TATHE D, SHAH J P

Aqueous carbon material dispersion liquid for forming film, comprises carbon material, water and dispersing agent containing polymer having structural unit derived from alkylene group-containing monomer and other copolymerizable monomer.

SHIMANAKA H, KAMABAYASHI J, MURAKAMI Y, DOI S, SATO S, HIROYUKI S, JUN K, YOSHIKAZU M, SEIJI D, YUZURU S, MURAKAMI K, SATO Y

Dispersion useful for manufacturing additive for encapsulating electronic components, comprises portion of cross-linkable moiety, and oxidized discrete carbon nanotubes with bonded dispersing agent.

IVANOVA O, LOWDER S, SWOGGER K W, BOSNYAK C P

Graphene thermostatic fabric includes a fibrous tissue and a graphene thermostatic layer. The fibrous tissue has a first tissue surface.

WU M Y, HSIEH C, CHEN J

Graphene thermostatic fabric for clothes material comprises fibrous tissue having first tissue surface, 2nd tissue surface, and interspace, and graphene thermostatic layer comprising hydrophobic resin and nano-graphene sheets.

WU M Y, HSIEH C, CHEN J, WU Y, XIE C

Flexible, low shrinkage, conductive formulation for coating substrate of articles and filling gaps in electronic packages comprises sinterable, conductive metal particles, graphene, diluent, and polymer resin.

HONG X, SANCHEZ J G, CAO X, ZHUO Q

Graphene composite coating layer for coating target object surface comprises curable mixed resin consisting of curable resin and curing agent and surface-modified nano graphene sheets which are evenly spread in curable mixed resin.

WU M Y, HSIEH C, SHUI C, WU Y, XIE C, HSIEH C Y, SHUI C K