国家/地区 台湾（26）
IPC部 B（26）
IPC大类 C08（26）
IPC小类 C09D（26）
IPC C08K003/04（13） B82Y030/00（8） B82Y040/00（8）
C08J007/04（7） C09D007/12（7） C09D011/03（6）
C09D011/52（6） B33Y070/00（5） C01B031/04（5）
C01B032/182（5） C09D007/61（5） C09D007/62（5）
C01B032/20（4） C08K003/08（4） C09C001/46（4）
发明人 HSIEH C（3） WU M Y（3） WU Y（3）
XIE C（3） CHAKI N K（2） CHEN J（2）
CHEN Z（2） HASEGAWA S（2） HASEGAWA SHOJI（2）
HSIEH C Y（2） KAMIYA N（2） KAMIYA NAGISA（2）
NAGISA K（2） RAUT R（2） RUSTOGI A（2）
公开年 2021（7） 2022（5） 2015（4） 2017（3） 2018（3） 2019（2）
申请年 2021（6）  2020（5）  2016（3）  2018（3）  2014（2）  2015（2）  2017（2）  2022（2） 
专利权人 ENERAGE INC（3） ALPHA ASSEMB.（2） ANJU SCI TE.（2） BEIJING XICH.（2）
GRAPHENE PLA.（2） GRAPHENE PLA.（2） WISCONSIN AL.（2）

Producing food packaging barrier film used for consumers to clearly see content of packaged goods, involves providing base film, depositing inorganic laminated film on surface of base film, where inorganic laminated film includes at least one first and second inorganic material deposition layer.

CHEN C, TSAO C, LIAO T, LIAO T C, TSAO C C, CHEN C H, CHEN Z, CAO J, LIAO D

Matter composition comprises epoxy functionalized two-dimensional shaped particles comprising functionalized graphene, clays, and alumina platelets, carbon nanotubes, epoxy resin, and curing agent comprising ionic liquid, and 1-ethyl-3-methylimidazolium dicyanamide.

KALB J, IFTIME G, WEI J, PANDEY R, RAHULPANDY, JUNHUA W, JAMIKALB

Transferring one or more nanostructures from one substrate to another substrate by applying coating of crosslinkable copolymer over one or more nanostructures on surface of substrate, heating, transferring nanostructures and copolymer onto another substrate surface, and removing copolymer.

ARNOLD M S, JACOBBERGER R M, GOPALAN P, DWYER J H

Coated substrate used for electronic device, comprises substrate comprising a metal or metal alloy, basecoat layer on substrate, where basecoat layer comprises pigment particles and one-part thermally cured polymeric resin, and anti-fingerprint topcoat layer on basecoat layer.

WU K, LI Y, CHANG C H, ZHU X

Condensation curable composition used as article in aerospace device, electronic device, electronic component, automobile, insulation, coating, or solvent resistant membrane, comprises condensation curable organopolysiloxane, silicone-imide crosslinker, condensation cure catalyst and additive.

DEY K, MILLER C, KONWAR D B, RAJENDRA V, FUJIMOTO T, MANDAL S

Composition for use in manufacture of in-mold electronic component, e.g. light emitting diode, comprises resin composition, and plastic composition.

CHAKI N K, SHAH C P, SINGH B, RAUT R, KAUSHIK V S, PANDHER R, NAGARAJAN N, KUMAR S M, RUSTOGI A, M S K, KAUSIK B, PANDER R, NAGARAZAN N, RUSTOGGI A

Coating insulation component in high temperature, high voltage and/or corrosive environments, by applying coating of heat processing composition of crosslinkable aromatic polymer to exterior surface of insulation component and crosslinking.

DRAKE K A, SONG L, GAVLIK R, GABRIEL R

Manufacture of antistatic packaging material involves mixing graphene, hardener, slow drying agent, anti-scratch agent, wear-resistant extension agent, defoaming agent, wetting agent and film-forming agent in mixer, and stirring.

ZHIYU L, WANG L, GAO R

Aqueous carbon material dispersion liquid for forming film, comprises carbon material, water and dispersing agent containing polymer having structural unit derived from alkylene group-containing monomer and other copolymerizable monomer.

SHIMANAKA H, KAMABAYASHI J, MURAKAMI Y, DOI S, SATO S, HIROYUKI S, JUN K, YOSHIKAZU M, SEIJI D, YUZURU S, MURAKAMI K, SATO Y

Dispersion useful for manufacturing additive for encapsulating electronic components, comprises portion of cross-linkable moiety, and oxidized discrete carbon nanotubes with bonded dispersing agent.

IVANOVA O, LOWDER S, SWOGGER K W, BOSNYAK C P