国家/地区 美国（5） 韩国（2）
IPC部 B（5）
IPC大类 C23（5）
IPC小类 C23C（5）
IPC C23C018/16（5）
发明人 JANG B Z（2） LEE J（2） LIN Y（2）
ZHAMU A（2）
公开年 2019（2）
申请年 2018（2） 
专利权人 NANOTEK INST.（2） SAMSUNG ELEC.（2）

Metal particles used in adhesive paste or solder paste for composite bonding structure for semiconductor device, comprises core including metal and shell on surface of core, where shell comprises metal and nanoparticles.

CHU K, LEE J, JUNGHOON L, CHU K M

Metal matrix nanocomposite used as e.g. load-bearing element, comprises metal or metal alloy containing gold and silver as matrix material, and multiple graphene sheet chosen from pristine graphene material or non-pristine graphene material.

ZHAMU A, LIN Y, JANG B Z

Producing metal matrix nanocomposite by preparing graphene dispersion, bringing the graphene dispersion in physical contact with solid substrate surface, and depositing layer of metal or metal alloy onto surfaces of aligned graphene sheets.

ZHAMU A, LIN Y, JANG B Z

Manufacturing method of graphene layer on substrate, involves exfoliating metalized graphene layer from first substrate and laminating metalized graphene layer to second substrate.

ZARETSKI A, LIPOMI D J

Resin plating comprises forming a graphene thin layer on a resin substrate and electroplating the resin substrate having the graphene thin layer formed on it.

BAE A H, SON S I, NAM J D, LEE J H, HWANG T S, OH J S, LEE H, EAH H B, SANG I S, JAE D N, JOON S O, JUN H L, TAE S H, HWANG T, LEE J, NAN J, PAE A, SUN S, OU J