国家/地区 美国（5） 韩国（3） 中国（2） 欧洲专利局（EPO）（2） 西班牙（2） 日本（2） 世界知识产权组织（2）
IPC部 B（5）
IPC大类 B32（5）
IPC小类 B32B（5）
IPC B32B038/10（5）
发明人 GUO L（2） HAN S（2） LI X（2）
公开年 2013（2） 2014（2）
申请年 2012（5）
专利权人 INT BUSINESS.（2）

Electrochemical etching method for removing metal substrate layer from graphene layer, involves connecting graphene layer or metal substrate layer to power source to supply current to etch metal substrate layer from graphene layer.

HAN S, GUO L, LI X

Apparatus for electrochemical or electroplating etching of copper foils from graphene for e.g. electronic device application, has anode including metal substrate layer etched from graphene layer in response to current flowing through anode.

HAN S, GUO L, LI X

Method for transferring graphene on substrate used in electronic device, involves depositing graphene on side of metal substrate, and stacking target substrate on metal substrate-graphene layer to form stacked structure.

GONG K

Copper foil for manufacturing graphene, has specified arithmetic mean roughness in rolling parallel direction and rolling perpendicular direction.

CHIBA YOSHIHIRO, CHIBA Y, CHIBA G, YOSHIHIRO C

Method for non-destructively transferring graphene, involves nondestructively combining graphene coated with media with target substrate, and removing media to transfer graphene to target substrate nondestructively.

REN W, GAO L, MA L, CHENG H