国家/地区 美国（218）
IPC部 B（218）
IPC大类 B32（218）
IPC小类 B32B（218）
IPC B32B009/00（107） C01B031/02（99） C01B031/04（98）
B82Y030/00（92） B82Y040/00（79） H01B001/04（68）
B32B009/04（44） C23C016/26（41） H01L021/02（36）
H01L029/16（32） B05D005/12（24） C01B031/00（23）
H01B005/14（23） H01B013/00（23） C01B032/194（22）
发明人 CHOI J（22） CHOI J Y（16） SHIN H（11）
SHIN H J（11） HONG B H（9） LEE S（9）
KIM H（8） AHN J（7） LEE Y（6）
YOON S（6） JANG B Z（5） JIANG K（5）
KIM H K（5） KIMURA N（5） LEE Y H（5）
公开年 2012（36） 2011（29） 2013（26） 2014（25） 2015（20） 2010（19） 2016（13） 2021（12） 2009（11） 2017（11） 2022（3） 2003（2） 2018（2） 2019（2） 2023（2）
申请年 2012（40）  2011（32）  2013（23）  2009（22）  2010（21）  2014（19）  2015（16）  2016（8）  2008（6）  2020（6）  2021（6）  2017（5）  2019（5）  2002（3）  2007（2）  2022（2） 
专利权人 SAMSUNG ELEC.（27） UNIV SUNGKYU.（13） UNIV SUNGKYU.（12） INT BUSINESS.（8）
HON HAI PREC.（6） HONGFUJIN PR.（6） SAMSUNG TECH.（6） SONY CORP（6）
UNIV TSINGHU.（6） EMPIRE TECHN.（5） GRAPHENE SQU.（5） HANWHA TECHW.（5）
HONG B H（5） NANOTEK INST.（5） UNIV SUNGKYU.（5） CHOI J（4）
JANG B Z（4） SUMITOMO ELE.（4） UNIV TOHOKU（4） WANG M（4）

Semiconductive polyolefin composition in power cable, comprises olefin polymer base resin, first carbonaceous structures, carbon black and/or second carbonaceous structures, and optionally additives, where first carbonaceous structures are selected from graphene, and modified graphene.

THEODORIDIS A, MANIKA G, KADAR R, GKOURMPIS T

Coating substrate by depositing a conductive layer comprising electrically conductive material over substrate, where conductive layer has specific resistivity, and depositing anti-icing layer comprising nanomaterials over conductive layer to form coating system.

KINLEN P J, PRIFTIS D

Thermal conductive structure comprises thermally conductive metal layer, and structural layer arranged on thermally conductive metal layer, where structural layer is stacked structure formed by graphene layer and ceramic material layer or structural layer is graphene-mixed ceramic material layer.

HUANG H, HUANG C, HE M, HANCHANGHUANG, HE M X, HUANG J K, HUANG H Z, WANG H

Adhesion promoting layer for depositing conductive layer on inorganic or organic-inorganic hybrid substrate to form conductive structure, includes metal oxide layer containing metal oxide and chelating agent, arranged on inorganic or organic-inorganic hybrid substrate, and interface layer.

HUANG M, WANG W, CHANG Y

Electromagnetic wave absorption structure comprises electromagnetic wave composite absorbing layer, where electromagnetic wave composite absorbing layer comprises conductive composite layer and insulating layer, and insulating layer is stacked and overlapped with conductive composite layer.

WU F

Coating insulation component in high temperature, high voltage and/or corrosive environments, by applying coating of heat processing composition of crosslinkable aromatic polymer to exterior surface of insulation component and crosslinking.

DRAKE K A, SONG L, GAVLIK R, GABRIEL R

Transferring graphene involves forming graphene on first substrate, forming polymer precursor mixture on second substrate, providing graphene oppositely to second substrate having polymer precursor mixture.

GU T J, JANG W, SEO Y, WHANG D, WHANG D M, SEO Y M, JANG W S

Polymer composition used for forming substrate for electronic device, comprises liquid crystalline polymer, electroconductive filler, and mineral filler, and has preset surface resistivity.

KIM Y S, JIN R

Foil used as surface section, has coating that is nano-coating in which graphene and silicon are present as nanoparticles, such that interaction of molecules or atoms of coating is made with kinetic energy of radiation.

SCHUBART H T

Method for providing continuous production of exfoliated two-dimensional (2D) material, involves passing two dimensional (2D) material in fluid through convergent-divergent nozzle to exfoliate 2D material before 2D material intercalates.

RIZVI S R, NGUYEN E P N, KANER R B