国家/地区 中国（6）
IPC部 B（6）
IPC大类 B29（6）
IPC小类 B29B（6）
IPC B29C043/02（6）
发明人
公开年 2018（2） 2022（2）
申请年 2022（3）  2017（2） 
专利权人

Preparing high-absorbing polymer-based electromagnetic shielding composite material useful in portable micro-electronic device, comprises crushing prepared magnetic particle/polymer composite material and conductive filler, paving in multiple layers and carrying out thermocompression molding.

ZHU H, WEN X, WU B

Preparing a cold/hot press molding of high-conductivity composite heat dissipation products useful in electronic device, comprises e.g. taking heat conduction material powder, aqueous resin, curing agent and processing aid, obtaining resin mixture, mixing, granulating, calendering and crushing.

LIN Y, LI K

Ring network used for treating control device polymer material comprises end amino hyper-branched polysiloxane HPSi-NH2, polymer (vinyl-2,8-bis(trifluoromethyl)quinoline and glycidyl methacrylate), conductive filler, graphene fiber, nanoboron fibers, coupling agent, and antioxidant.

RAN Z, JIN K, CHEN Y

Preparing surface micro-nano structure of polymer composite material comprises e.g. melt-blending polypropylene, graphene powder, lubricant and coupling agent, extruding and molding polymer composite material and demolding.

CHEN A, LI C, XIE W, HE X, DING S, ZHANG Z

Graphene/hard nanoparticle cooperatively modified phenolic resin wear-resistant material comprises functionalized hard nanoparticles and graphene and phenolic resin.

ZHOU S, WANG J, LIU Y, WANG S, ZHAO G

Preparing flange involves mixing and crushing raw materials to obtain raw material powder, where raw materials includes polyethylene, glass fiber, butyl or propyl cellulose acetate, and graphene powder and raw material powder is dried.

TANG L