国家/地区 韩国（25）
IPC部 B（25） C（17） H（8）
F（3）
IPC大类 B32（25）
IPC小类 B32B（25）
IPC B32B027/18（8） B32B007/12（7） C08K003/04（5）
B32B015/08（4） B32B015/20（4） B32B027/08（4）
B32B009/00（3） B32B027/12（3） B32B027/20（3）
B32B027/28（3） B32B027/30（3） B32B027/32（3）
B32B027/36（3） B32B037/12（3） B32B038/00（3）
发明人 YI S（3） HAN G（2） ZHANG S（2）
公开年 2022（25）
申请年 2021（25）
专利权人 ALPHA GRAPHE.（3） CHINA PETROL.（2）

Producing coating composition in heat dissipation sheet for device, comprises mixing carbon nanotubes, graphene and dispersant in solvent, performing sonication, and mixing first mixture with binder and polymer compound.

SON I, PIL L S

Semi-incombustible metal panel comprises core material bonded between two metal plates and comprising surface-modified magnesium hydroxide, surface-modified graphene oxide, surface-modified cordierite, surface-modified glass fiber and flame-retardant polymer binder.

HAN G, LEE J

Porous sound absorbing material having optimal nanomaterial impregnation structure useful for adjusting modulus of elasticity and heat transfer, comprises porous member and nanomaterials impregnated into porous member.

JEONG I W, JUNE K, LEE J H

Plastic case with electromagnetic shielding and antibacterial functions useful in mobile electronic device, comprises second layer overlaid on upper surface of first layer, and third layer overlaid on top surface of second layer.

CHEONJISEUNG, HYEON J D

Electromagnetic wave absorber for aircraft doors, comprises composite material of sandwich structure in which surface material is laminated on both sides of conductive core material.

KIM J K, CHOI K

Environmentally friendly laminated film useful in packaging material comprises e.g. polybutylene adipate terephthalate, polyhydroxy aldehyde, polybutylene succinate, thermoplastic starch, polylactic acid, polyethylene and polypropylene.

PARK K, KIM J H, KYUNG L

Active responsive multi-scale sound absorbing material used in machine e.g. engine, comprises shape memory polymer panel comprising open cells, porous polymer foam located inside open cell and bond to cell wall of open cell, and nanofiber mat layer.

KIM S, ON S Y

Thin encapsulating mounting structure for evaporation and heat dissipation applications for electronic component, has specific thin film portion whose one surface is fixed to fixing portion, and preset thin film portion, fixing portion and specific thin film portion that are assembled.

LU J, LUGECHI, LU J Q

Laminate structure e.g. for printed circuit board of electronic device comprises metal wiring layer formed on substrate, graphene layer formed on metal wiring layer and first encapsulant layer formed on graphene layer, contains metal oxide.

HYEOK I, HAN G, JUN H Y, LIM C

Heat dissipation sheet comprises e.g. graphite layer, primary graphene layer stacked on one side of graphite layer with primary adhesive layer interposed there between and secondary graphene layer stacked with secondary adhesive layer.

PARK J, YOUNG C, CHOI C Y, PARK J U, CHOI C, PIAO Z