国家/地区 中国（4）
IPC部 B（4）
IPC大类 B32（4） C08（3）
IPC小类 B32B（4）
IPC B32B037/06（4）
发明人 CHEN Y（4）
公开年 2021（2）
申请年
专利权人 JIANGSU YAO .（2）

Preparing silicon dioxide filling type epoxy resin copper-clad plate by vacuum-drying nano-silicon dioxide powder, mixing with gamma-aminopropyltriethoxysilane, adding to xylene, drying, dispersing oxidized graphene- silicon dioxide composite material, covering copper foil and curing.

XIE J, WANG X, CHEN Y

Epoxy resin-based copper-clad plate filled with alumina used for e.g. electric device insulation has electronic glass fiber cloth, dipping material and copper foil, where electronic glass fiber cloth is soaked in dipping material and processed into prepreg and copper foil set on two sides of prepreg.

WU H, CHEN Y

High-absorption electromagnetic shielding composite film for preparation of electromagnetic shielding materials, is double-layer composite film made of film made of porous carbon material and polymer matrix material, and another film made of conductive material and polymer matrix material.

SHEN L, ZHANG H, CHEN Y, FEI Y, YUAN M, ZOU H

Manufacture of voltage-resistant and layering-resistant aluminum-based graphene plate involves e.g. fixedly connecting aluminum plate with graphene through prepreg, coupling aluminum plate and prepreg to improve bonding strength of surface.

LI Y, CHEN Y