国家/地区 中国（5）
IPC部 B（5）
IPC大类 B32（5） C08（4）
IPC小类 B32B（5）
IPC B32B037/06（5）
发明人 WANG X（5）
公开年 2021（2） 2023（2）
申请年 2022（2） 
专利权人 JIANGSU YAO .（2）

Preparing polyphenylene oxide resin-based copper clad laminate comprises taking glass fiber cloth and impregnating a glue solution, drying to obtain prepreg, taking 5-10 sheets of prepregs, laminating them, and covering piece of copper foil on both sides of laminated prepregs.

XIE J, WANG X, WU H

Preparing silicon dioxide filling type epoxy resin copper-clad plate by vacuum-drying nano-silicon dioxide powder, mixing with gamma-aminopropyltriethoxysilane, adding to xylene, drying, dispersing oxidized graphene- silicon dioxide composite material, covering copper foil and curing.

XIE J, WANG X, CHEN Y

Method for preparing metal-graphene composite material by using electronic component, involves preparing metal-graphene composite material by hot-pressing sintering, and applying pulse current to metal substrate to perform surface heat treatment to metal substrate.

WANG X, HUO Y, LI J, CAO Z, XIAO Z

Toughening material for prepregs used in high-toughness composite material, comprises carbon material aerogel and thermoplastic resin.

TANG J, ZHANG O, YU R, WANG X, WANG F

Preparing non-woven fabric composite board comprises e.g. paving non-woven fabric core layer on base material, paving thermoplastic plastic film on non-woven fabric core layer, and paving fluorine rubber layer on thermoplastic plastic film.

WANG X