国家/地区 中国（7）
IPC部 B（7）
IPC大类 B32（7） C08（7） H05（3）
IPC小类 B32B（7）
IPC C08J005/24（7）
发明人 LI Y（2）
公开年 2021（7）
申请年 2020（4）  2021（2） 
专利权人

Resin composition used to prepare prepreg for metal-clad laminate for preparing printed circuit board, comprises bismaleimide compounds and vinyl-containing elastomer.

CHIANG J, CHIOU J, LIU S

Resin composition used to form dielectric substrate layer and prepreg used to form printed circuit board, comprises polymeric based material and fillers comprising hollow fillers comprising hollow filler, and material of hollow filler is silicon dioxide.

CHANG C, WU Y, ZHANG C

Thermal deformation support arm used for controlling space reflector unfolding state, and obtained by blending bidirectional shape memory polymer matrix phase and matrix enhanced phase by physical method.

CHENG Z, JIAO S, CHI D, ZHANG D, LIU Y, GUO X, KANG W

Flexible metal-based graphene electric heating material, comprises flexible insulating layer, flexible graphene resistance layer, flexible insulating layer, and metal substrate arranged sequentially from top to bottom.

LI Y, LOU M

Toughening material for prepregs used in high-toughness composite material, comprises carbon material aerogel and thermoplastic resin.

TANG J, ZHANG O, YU R, WANG X, WANG F

Heat-resistant epoxy resin composition for preparing halogen-free intermediate-glass-transition-temperature copper-clad plate, contains graphene-modified epoxy resin, graphene-modified phenolic epoxy resin, and tetrafunctional epoxy resin.

LI Y, LIN Y, CHEN W, WEN J

Hot melt prepreg processing borosilicate phenolic resin comprises phenol, aldehyde, boron-containing compound, silicate, modifier and toughening agent, modifier, and toughening agent.

YAO Y, WEI X, LIU J, WANG L, LIU H, TIAN M