国家/地区 中国（8） 欧洲专利局（EPO）（2） 日本（2） 韩国（2） 美国（2） 世界知识产权组织（2）
IPC部 B（8）
IPC大类 B32（8）
IPC小类 B32B（8）
IPC C08K003/04（8）
发明人 GAO Y（2）
公开年 2021（3） 2017（2） 2023（2）
申请年 2020（3）  2016（2）  2022（2） 
专利权人

Processing wire-drawing aluminum-plastic composite plate useful in household decoration field, comprises e.g. mixing octafluoropentanol and tetrahydrofuran solution, stirring, mixing hexachlorocyclotriphosphazene, reacting, melting, extruding, molding, adhering adjacent plates and hot pressing.

QIAN C

High thermal conductivity composition useful for preparation of thermally conductive materials, comprises grafted resin, curing agent e.g. cetyl ammonium bromide, thermally conductive filler e.g. aluminum oxide and modified graphene oxide.

YANG X, WAN F, TAN P

Surface-treatment composition used for vibration damping steel sheet, comprises polymer resin and inorganic nanoparticles having preset average aspect ratio.

KIM J, LEE J, KIM Y, CHOI H, CHOI Y, KIM J T, KIM Y S, CHOI Y H, CUI H, JIN Y, LI Z

Electromagnetic shielding composite material useful in field of 5G communication or aerospace, comprises absorption layer and reflective layer compounded on absorption layer; absorption layer includes modified resin layer.

RAN X, WANG C, FU C, NIE W, QIAN J, GAO Y, CHU H

Polyethylene (PE) multilayer barrier composite film comprises PE/adhesive layer/ethylene vinyl alcohol composite barrier layer/adhesive layer/PE which are laminated layer by layer.

ZHANG Q, LI Y, WANG W, LI G

Preparation of composite low thermal conductivity material involves adding material formed of graphene composite system, material formed of fullerene, and material formed of polystyrene, to film making machine, and hot-pressing.

HAN J, LIANG G, WANG Z

Oxygen-barrier floor heating pipe comprises an inner layer (of modified graphene oxide, fluoropolymer and polymer matrix), an outer layer (of e.g. polymer matrix), an adhesive layer (of e.g. hot melt adhesive) and an oxygen-barrier layer.

WANG J, GAO Y, XIE W

Graphene compound for barrier element and clear packaging for product comprises optionally functionalized graphene directly bonded to nitrogen-containing compound.

ZHENG S