国家/地区 美国（4） 中国（3） 韩国（3） 世界知识产权组织（3） 欧洲专利局（EPO）（2） 日本（2） 台湾（2）
IPC部 B（5）
IPC大类 B32（5）
IPC小类 B32B（5）
IPC C09K005/14（5）
发明人
公开年 2014（5）
申请年 2014（3）  2013（2） 
专利权人

Heat discharging sheet for heat source, has heat discharging layer comprising graphene and metal particles, and having first surface on which adhesive layer is disposed and second surface on which protective layer is disposed.

LEE D, BYUN N, LEE S

Silicon glue heat conducting structure has silicon resin layer that is connected with adhesive layer, and graphene conducting film that is directly connected with heat cover and silicon resin layer.

WU F

Heat-dissipating sheet used for electronic device, consists of metal layer, graphene layer, protective layer, adhesive layer, and release layer in contact with surface of adhesive layer, and has preset thermal conductivity.

LEE M, JEONG H, LEE M H, ZHENG X

Graphene-filler composite material for use as conductive elements such as wire, has graphene-filler composite that is provided with graphene layers that are separated each other by filler layer made of copper.

DARDONA S, SCHMIDT W R, VERONESI W A, ELWARDANY T I

Thermal radiation film for e.g. electronic devices comprises heat-transfer layer formed by uniformly dispersed graphene microparticles and carbon nanotube.

KAGAWA S, SEIJI K