国家/地区 美国（5） 世界知识产权组织（4） 中国（3） 日本（2） 韩国（2）
IPC部 B（6）
IPC大类 B32（6） C09（6） H01（5）
C01（2） F28（2） H05（2）
IPC小类 B32B（6）
IPC C09K005/14（6）
发明人
公开年 2014（3） 2015（2）
申请年 2014（6）
专利权人

Composite composition useful in an electronic device, comprises an epoxy matrix, microsize graphite and nanosize graphene sheets.

ABRAMSON A, MANASZLOCZOWER I, MAHANTA N K, LOOS M R

Forming composite material used in multimodal transport comprises enabling polymer to wick into hollow channels of three-dimensional graphene, curing polymer, adding active material and removing polymer from within hollow channels.

MCKAY I S, YANG S, WANG E N, KIM H

Composition, used in a phase change material which is useful e.g. as thermal conductivity substrate for flexible graphene electronic devices, as electrode in battery, and in a thermal storage device, comprises galactitol and mannitol.

DA SILVA A K, FLEMING E, SHI L, BIELAWSKI C W, RUOFF R S, WEN S, JI H, PETTES M, PAUL A, PAEK E, PAK A J, SELLAN D P, FLAMING E, DA SILVAA A K

Heat discharging sheet for heat source, has heat discharging layer comprising graphene and metal particles, and having first surface on which adhesive layer is disposed and second surface on which protective layer is disposed.

LEE D, BYUN N, LEE S

Silicon glue heat conducting structure has silicon resin layer that is connected with adhesive layer, and graphene conducting film that is directly connected with heat cover and silicon resin layer.

WU F

Heat-dissipating sheet used for electronic device, consists of metal layer, graphene layer, protective layer, adhesive layer, and release layer in contact with surface of adhesive layer, and has preset thermal conductivity.

LEE M, JEONG H, LEE M H, ZHENG X