国家/地区 中国（5）
IPC部 B（6）
IPC大类 B32（6） C09（6）
IPC小类 B32B（6）
IPC C09K005/14（6）
发明人 WANG H（2）
公开年 2021（4） 2022（2）
申请年 2021（6）
专利权人

Thermal conductive structure comprises thermally conductive metal layer, and structural layer arranged on thermally conductive metal layer, where structural layer is stacked structure formed by graphene layer and ceramic material layer or structural layer is graphene-mixed ceramic material layer.

HUANG H, HUANG C, HE M, HANCHANGHUANG, HE M X, HUANG J K, HUANG H Z, WANG H

Wireless charging receiving end wafer module structure comprises two adjacent nano-crystal layers bonded by heat-conducting double-sided adhesive tape, nano wafer layers whose outer surface is located in uppermost layer and lowermost layer adhered with polyethylene terephthalate film.

YANG J, HU S, GU B

Graphene composite radiating film comprises n-layer graphene film and m-layer worm graphite film.

CHENG W, LIU X, ZHOU Y, WANG W, LI L

Directional high thermal conductivity thermal interface thermal conductivity material useful for high thermal conductivity graphite-based thermal interface composite material structure, comprises graphite paper and silicone rubber.

ZHU Y, WANG H

Phase change energy storage thermal insulation plate containing aerogel useful e.g. in composite material field, comprises skin layer structure covering surface of core plate structure including uniform porous material and filling layer.

LI T, WANG Y, LI Q

Heat conducting chain based on graphene macroscopic assembly film has a normal heat conducting layer located at the cold end and the hot end, and includes a solder layer which is connected with the surface of the graphene layer.

GAO C, ZHOU J, LIU Y, LIU Z, XU Z, WANG Z, HE G