国家/地区 台湾（5）
IPC部 B（5）
IPC大类 B32（5）
IPC小类 B32B（5）
IPC C09K005/14（5）
发明人
公开年 2014（2）
申请年
专利权人

Thermal conductive structure comprises thermally conductive metal layer, and structural layer arranged on thermally conductive metal layer, where structural layer is stacked structure formed by graphene layer and ceramic material layer or structural layer is graphene-mixed ceramic material layer.

HUANG H, HUANG C, HE M, HANCHANGHUANG, HE M X, HUANG J K, HUANG H Z, WANG H

Preparing nitrogen-doped graphene, used to produce composite heat dispatching plate, comprises mixing solid-state nitrogen containing precursor with a graphene to form a mixture, and sintering the mixture under reducing atmosphere.

LIU W J, SHEN J, XIE Z Z, LIU W, XIE Z

Graphene dissipation structure for e.g. heat dissipation devices, has substrate containing surfaces, and graphene dissipation layer containing surface-modified graphene nano sheets, carrier resin and filler, in specified weight ratio.

WU M Y, HSIEH C, CHEN J, HSIEH S, LI K, XIE S, WU Y, XIE C, LI G, HSIEH C Y, CHEN J R, HSIEH S L, LI K T

Heat-dissipating sheet used for electronic device, consists of metal layer, graphene layer, protective layer, adhesive layer, and release layer in contact with surface of adhesive layer, and has preset thermal conductivity.

LEE M, JEONG H, LEE M H, ZHENG X

Thermal radiation film for e.g. electronic devices comprises heat-transfer layer formed by uniformly dispersed graphene microparticles and carbon nanotube.

KAGAWA S, SEIJI K