国家/地区 德国（4）
IPC部 B（4） C（2） F（2）
H（2）
IPC大类 B32（4）
IPC小类 B32B（4）
IPC B32B007/12（2）
发明人
公开年 2021（2） 2022（2）
申请年 2021（4）
专利权人

Thin encapsulating mounting structure for evaporation and heat dissipation applications for electronic component, has specific thin film portion whose one surface is fixed to fixing portion, and preset thin film portion, fixing portion and specific thin film portion that are assembled.

LU J, LUGECHI, LU J Q

Multilayer electrode for capacitive pressure sensor of e.g. rotogravure printer, involves press-rolling XY layer and co-extruded layers together for forming multi-layer electrode and printing electrically conductive ink onto polymer layer.

SALTER S C, BUTTOLO P, DELLOCK P K, GALL R, CHASCSA J R, RICHARD G

Anti-fouling coating for use in e.g. optical instrument, has coating layer formed on substrate, where coating layer is made of indium tin oxide, and dielectric layer formed between coating layer and substrate.

WILKEN R, SPECHT U, LUKASCZYK T

Assembly for a battery, includes thermal management multilayer sheet equipped on surface of an electrochemical cell, and thermal management multilayer sheet comprising thermally-insulating layer.

CHURCHILL C, DAIGLE R C, KILHENNY B, DAGLE R